XC6VHX250T-2FFG1154C

The XC6VHX250T-2FFG1154C is a Virtex®-6 HXT field programmable gate array offered in a 1156‑FCBGA package. The device provides high logic capacity and on‑chip memory with a 320‑pin I/O count, targeting complex, high‑density programmable logic designs.

Key electrical and environmental parameters include a supply voltage range of 950 mV to 1.05 V, RoHS compliance, and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  Approximately 251,904 logic elements and 19,680 CLBs enable implementation of large-scale programmable logic and complex functions.
• Embedded Memory  Approximately 18.58 Mbits of on‑chip RAM supports data buffering, FIFOs, and local storage for state machines and processing blocks.
• I/O  320 available I/O pins provide flexible connectivity for multi‑lane interfaces, parallel buses, and mixed signal partitions.
• Package & Mounting  1156‑BBGA / 1156‑FCBGA (35×35) package in a surface‑mount form factor for dense board integration.
• Power  Core supply range of 950 mV to 1.05 V to match system power rails and enable predictable power budgeting.
• Temperature & Grade  Commercial grade device rated for operation from 0 °C to 85 °C to meet typical commercial and industrial ambient requirements.
• Compliance  RoHS compliant for regulatory and assembly process compatibility.

Typical Applications

• High‑density FPGA designs  Leverage the device’s ~251,904 logic elements and ~18.58 Mbits of embedded memory for large programmable logic implementations and complex state machines.
• Multi‑lane I/O systems  Use the 320 I/O pins to interface with multiple high‑speed lanes, parallel buses, or I/O‑rich subsystems.
• On‑board buffering and processing  Embedded RAM capacity supports local data buffering, FIFOs, and temporary storage for data‑path and control logic.

Unique Advantages

• High logic density: Provides approximately 251,904 logic elements to consolidate complex functionality into a single FPGA, reducing system component count.
• Substantial embedded memory: Approximately 18.58 Mbits of on‑chip RAM enables large local buffers and state storage without external memory.
• Ample I/O: 320 I/O pins deliver flexibility for multi‑interface designs and extensive external device connectivity.
• Compact FCBGA package: 1156‑FCBGA (35×35) surface‑mount package allows dense PCB layouts while supporting high pin counts.
• Predictable power envelope: Core supply range of 950 mV to 1.05 V simplifies power‑rail design and verification.
• Regulatory readiness: RoHS compliance supports modern assembly and environmental requirements.

Why Choose XC6VHX250T-2FFG1154C?

The XC6VHX250T-2FFG1154C positions itself as a high‑capacity Virtex®‑6 HXT FPGA option for designers needing significant logic resources, substantial on‑chip memory, and a large I/O count in a compact FCBGA package. Its electrical and environmental specifications—including a 950 mV–1.05 V core supply, RoHS compliance, and commercial temperature grading—make it suitable for demanding commercial designs that require dense programmable logic integration.

This part is well suited for engineering teams focused on consolidating complex digital functions onto a single programmable device while maintaining predictable power and board integration characteristics. The device’s capacity and package offer a scalable foundation within systems that benefit from high logic density and extensive I/O.

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