XC6VHX255T-2FFG1923C

The XC6VHX255T-2FFG1923C is a Virtex®-6 HXT Field Programmable Gate Array (FPGA) IC designed for high-density programmable logic applications. It combines a large logic capacity with substantial on-chip memory and a high I/O count in a surface-mount FCBGA package suitable for commercial-temperature designs.

Key Features

• High Logic Density — 253,440 logic elements to support complex digital designs and extensive logic integration.
• Embedded Memory — Approximately 19 Mbits of on-chip RAM (19,021,824 bits) for buffering, storage, and local data processing.
• Extensive I/O — 480 I/O pins provide broad interfacing capability for peripherals and external subsystems.
• Power — Core voltage supply range of 0.95 V to 1.05 V to match system power requirements.
• Package & Mounting — 1924-FCBGA (45×45) / 1924-BBGA package in a surface-mount form factor for high-density board designs.
• Operating Range & Grade — Commercial temperature rating from 0 °C to 85 °C and commercial device grade.
• Regulatory — RoHS compliant for environmental and regulatory compatibility.

Typical Applications

• High-density digital processing — Suited for designs that require a large number of logic elements and substantial on-chip memory for complex algorithms and data flows.
• I/O-intensive system control — 480 I/O pins enable broad peripheral and subsystem interfacing in control and instrumentation applications.
• Embedded system prototyping — Commercial-grade FPGA for developing and validating high-capacity programmable logic designs.

Unique Advantages

• High integration density: 253,440 logic elements allow consolidation of multiple functions into a single device, simplifying board-level design.
• Large on-chip memory: Approximately 19 Mbits of embedded RAM supports substantial local buffering and reduces dependence on external memory.
• Broad interfacing capability: 480 I/Os provide flexibility for connecting to numerous peripherals and subsystems without additional interface components.
• Compact, surface-mount package: 1924-FCBGA (45×45) package supports high-density PCB layouts while maintaining a high pin count.
• Commercial-temperature operation: Rated 0 °C to 85 °C for applications targeting commercial environments.
• RoHS compliant: Meets RoHS requirements for environmentally conscious designs.

Why Choose XC6VHX255T-2FFG1923C?

The XC6VHX255T-2FFG1923C positions itself as a high-capacity FPGA option for designs that demand extensive logic resources, significant on-chip memory, and a large number of I/Os in a surface-mount FCBGA package. Its commercial-temperature rating and RoHS compliance make it suitable for production systems within commercial operating environments.

This device is appropriate for engineers and procurement teams building complex programmable logic systems that require scalable logic capacity, integrated memory resources, and comprehensive I/O in a compact package.

Request a quote or submit an inquiry to discuss availability, pricing, and how the XC6VHX255T-2FFG1923C can fit into your next design.