XC6VHX380T-2FFG1154C
| Part Description |
Virtex®-6 HXT Field Programmable Gate Array (FPGA) IC 320 28311552 382464 1156-BBGA, FCBGA |
|---|---|
| Quantity | 1,695 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1156-FCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA, FCBGA | Number of I/O | 320 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 29880 | Number of Logic Elements/Cells | 382464 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28311552 |
Overview of XC6VHX380T-2FFG1154C – Virtex®-6 HXT FPGA, 1156-FCBGA
The XC6VHX380T-2FFG1154C is a Virtex®-6 HXT Field Programmable Gate Array (FPGA) from AMD, provided in a 1156-FCBGA (35×35) package. It delivers large-scale programmable logic resources and embedded RAM with a 320‑pin I/O footprint for commercial-temperature applications.
Designed for designs that require significant on-chip logic and memory capacity, the device operates at a core supply range of 0.95 V to 1.05 V and is rated for 0 °C to 85 °C operation. The part is RoHS compliant and intended for surface-mount assembly.
Key Features
- Core Logic Approximately 382,464 logic elements organized across about 29,880 logic blocks to support large, complex programmable designs.
- Embedded Memory Approximately 28.3 Mbits of on-chip RAM for buffering, packet storage, or local scratch memory.
- I/O Capacity 320 user I/O pins to enable broad interfacing options with external devices and subsystems.
- Power Core voltage supply range of 0.95 V to 1.05 V to match system power budgets and platform requirements.
- Package & Mounting 1156-FCBGA (35×35) package, surface-mount, providing a high-density package option for compact board layouts.
- Operating Range & Grade Commercial grade device rated for operation from 0 °C to 85 °C for typical commercial environments.
- Environmental Compliance RoHS compliant, meeting common environmental and lead-free manufacturing requirements.
Typical Applications
- High-density custom logic implementations Use the device where extensive programmable logic resources are needed to implement complex functions on a single chip.
- On-chip data buffering and storage Leverage approximately 28.3 Mbits of embedded RAM for intermediate data storage, queueing, or local memory tasks.
- Multi-interface systems The 320 I/O pins support designs that require connectivity to multiple external interfaces or parallel data paths.
Unique Advantages
- High logic capacity: Approximately 382,464 logic elements enable implementation of large-scale custom logic and complex state machines without external logic.
- Substantial embedded memory: Around 28.3 Mbits of on-chip RAM reduces dependency on external memory for many buffering and scratch-storage needs.
- Ample I/O flexibility: 320 I/O pins provide the headroom to connect multiple peripherals, buses, or parallel interfaces directly to the FPGA.
- Compact, high-density package: 1156-FCBGA (35×35) packaging supports dense PCB layouts while maintaining a high pin count.
- Commercial temperature rating: Rated for 0 °C to 85 °C operation to suit a wide range of commercial applications and environments.
- RoHS compliant: Supports lead-free and environmentally conscious manufacturing processes.
Why Choose XC6VHX380T-2FFG1154C?
The XC6VHX380T-2FFG1154C positions itself as a high-capacity, on-chip resource-rich FPGA in the Virtex‑6 HXT family, combining hundreds of thousands of logic elements, substantial embedded RAM, and a large I/O count in a 1156‑pin FCBGA package. Its commercial-grade operating range and RoHS compliance make it suitable for mainstream electronic products requiring configurable logic and integrated memory.
This device is well suited for designers who need to consolidate complex logic, local memory, and multiple external interfaces into a single programmable device, supporting scalable designs that benefit from high integration and compact packaging.
Request a quote or submit a procurement inquiry to get pricing and availability for the XC6VHX380T-2FFG1154C. Our team can assist with lead times and order placement.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








