XC6VHX380T-2FFG1155C

The XC6VHX380T-2FFG1155C is a Virtex®-6 HXT field programmable gate array (FPGA) provided in a 1156-FCBGA (35×35) package. It delivers high on-chip logic and memory capacity with a broad I/O complement for complex digital designs.

This commercial-grade FPGA suits applications that require large logic capacity, substantial embedded memory, and significant I/O connectivity while operating from a core supply of 0.95 V to 1.05 V and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core & logic capacity — 382,464 logic elements to support large-scale, highly parallel digital functions and complex logic implementations.
• Embedded memory — approximately 28.3 Mbits of on-chip RAM for local buffering, lookup tables, and state storage without external memory dependency.
• Logic blocks — 29,880 logic blocks to structure and distribute logic resources efficiently across the device.
• I/O connectivity — 440 user I/O pins to interface with a wide range of peripherals, buses, and external devices.
• Power — core voltage supply range 950 mV to 1.05 V to match system power domains and regulator choices.
• Package & mounting — 1156-FCBGA (35×35) package case, supplied as a surface-mount FCBGA for compact board-level integration.
• Operating range & grade — commercial grade with an operating temperature range of 0 °C to 85 °C for general-purpose electronic systems.
• RoHS compliance — lead-free and RoHS compliant for regulatory and environmental compliance in applicable markets.

Typical Applications

• High-density logic systems — Implement complex state machines, custom datapaths, and parallel processing where large logic element counts are required.
• On-chip memory dependent designs — Leverage approximately 28.3 Mbits of embedded RAM for buffering, LUT-based functions, and intermediate data storage to reduce external memory needs.
• Interface aggregation — Use 440 I/O pins to consolidate multiple peripheral interfaces and bridge diverse signaling domains on a single device.
• Prototyping and system integration — Integrate large digital designs into surface-mount 1156-FCBGA form factors for evaluation and subsystem consolidation.

Unique Advantages

• High logic density: 382,464 logic elements provide the capacity to implement extensive logic networks and parallel processing engines on one device.
• Significant embedded memory: Approximately 28.3 Mbits of on-chip RAM reduces dependence on external memory and simplifies board-level design.
• Extensive I/O: 440 user I/Os enable direct connectivity to numerous peripherals and buses without additional interface chips.
• Compact FCBGA packaging: 1156-FCBGA (35×35) package supports space-efficient PCB layouts while maintaining high pin-count access.
• Commercial temperature and RoHS compliance: Designed for general-purpose electronics with RoHS compliance for environmental requirements.

Why Choose XC6VHX380T-2FFG1155C?

The XC6VHX380T-2FFG1155C positions itself for designs that demand abundant logic resources, substantial on-chip memory, and broad I/O connectivity in a compact surface-mount FCBGA package. Its commercial-grade operating range and RoHS compliance make it suitable for mainstream electronic systems that require integration of complex digital functions.

This device is appropriate for engineering teams implementing large logic arrays, memory-intensive algorithms, or multi-interface subsystems that benefit from consolidated FPGA-based integration and the specified power and thermal operating envelope.

Request a quote or submit an inquiry to obtain pricing, lead time, and availability for the XC6VHX380T-2FFG1155C. Our team can assist with technical details and purchasing options to support your design needs.