XC6VHX380T-2FFG1923I

The XC6VHX380T-2FFG1923I is a Virtex®-6 HXT Field Programmable Gate Array (FPGA) in a 1924-FCBGA package. It delivers a high-capacity programmable fabric with 382,464 logic elements and approximately 28 Mbits of embedded memory, making it suitable for complex, high-density digital designs.

Designed for industrial environments, this surface-mount FPGA offers 720 I/O pins, a core voltage supply range of 0.95 V to 1.05 V, and an operating temperature range of -40 °C to 100 °C. RoHS-compliant and supplied in a 1924-FCBGA (45×45) package, it targets designs that require significant on-chip logic and memory resources in a robust package.

Key Features

• Programmable Logic Capacity 382,464 logic elements provide extensive routing and logic resources for large-scale implementations.
• Embedded Memory Approximately 28 Mbits of on-chip RAM to support buffering, state storage, and data processing tasks.
• High I/O Count 720 I/O pins enable broad external connectivity for parallel interfaces, wide buses, and multi-channel systems.
• Package and Mounting 1924-FCBGA (45×45) package, surface-mount mounting type suitable for high-density PCB designs.
• Power Core voltage supply range of 0.95 V to 1.05 V to match platform power envelopes and regulator designs.
• Industrial Temperature Grade Specified operating temperature from -40 °C to 100 °C to meet industrial environment requirements.
• Regulatory Compliance RoHS-compliant for environmental and manufacturing compliance.

Unique Advantages

• High integration density: Large logic element count and significant on-chip RAM reduce the need for external components and simplify board-level design.
• Extensive I/O capability: 720 I/O pins provide flexibility for wide parallel interfaces, multiple high-speed links, or numerous peripheral connections.
• Industrial-grade thermal range: Operation from -40 °C to 100 °C supports deployment in demanding temperature environments.
• Compact, high-pin-count package: The 1924-FCBGA (45×45) package offers a balance of high I/O and manageable PCB footprint for dense system implementations.
• Controlled core power envelope: A specified 0.95 V to 1.05 V supply range facilitates predictable power subsystem design.
• RoHS compliance: Meets common environmental regulations for standard commercial and industrial manufacturing processes.

Why Choose XC6VHX380T-2FFG1923I?

The XC6VHX380T-2FFG1923I positions itself as a high-capacity Virtex®-6 HXT FPGA option for engineers needing large programmable logic resources, substantial embedded memory, and broad I/O in an industrial-grade device. Its combination of 382,464 logic elements, approximately 28 Mbits of on-chip RAM, and 720 I/O pins delivers a platform capable of supporting complex digital systems while maintaining clear electrical and thermal specifications.

This part is suited to teams and designs that require scalable on-chip resources, a high pin count in a compact FCBGA footprint, and operation across a wide temperature range. The documented supply voltage range and RoHS compliance support reliable integration and regulatory alignment for long-term deployments.

Request a quote or submit an inquiry to receive pricing, availability, and additional ordering details for XC6VHX380T-2FFG1923I.