XC6VHX380T-2FFG1924I

IC FPGA 640 I/O 1924FCBGA
Part Description

Virtex®-6 HXT Field Programmable Gate Array (FPGA) IC 640 28311552 382464 1924-BBGA, FCBGA

Quantity 265 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time14 Weeks
Datasheet

Specifications & Environmental

Device Package1924-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1924-BBGA, FCBGANumber of I/O640Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs29880Number of Logic Elements/Cells382464
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28311552

Overview of XC6VHX380T-2FFG1924I – Virtex®-6 HXT Field Programmable Gate Array (FPGA), 1924-FCBGA

The XC6VHX380T-2FFG1924I is a Virtex-6 HXT Field Programmable Gate Array (FPGA) in a 1924-FCBGA package, designed for high-density programmable logic implementations. It combines large logic capacity, substantial on-chip memory, and a high I/O count in an industrial-grade, surface-mount form factor.

This device is suited to designs that require significant programmable resources—offering extensive logic elements, approximately 28.3 Mbits of embedded memory, and 640 I/O—while operating over an industrial temperature range and low-voltage core supply.

Key Features

  • High Logic Capacity  382,464 logic elements to implement large-scale, complex digital designs.
  • Embedded Memory  Approximately 28.3 Mbits of on-chip RAM for buffering, caching, and local data storage.
  • Extensive I/O  640 user I/O pins to support wide parallel interfaces and multiple external peripherals.
  • Core Voltage Range  Core supply voltage operating between 950 mV and 1.05 V to match system power domains.
  • Industrial Temperature Range  Specified operation from -40 °C to 100 °C for demanding environmental conditions.
  • Package and Mounting  1924-FCBGA (45×45) package; surface-mount mounting type for compact board-level integration.
  • RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

  • Communications Infrastructure  High I/O count and large logic capacity enable implementation of complex data-plane and control-plane functions.
  • High-Performance Data Processing  Large embedded memory and substantial logic resources support buffering, packet handling, and custom acceleration tasks.
  • Industrial Control and Test Equipment  Industrial-grade temperature range and robust packaging suit deployment in industrial environments requiring extended operating conditions.

Unique Advantages

  • Highly Integrated Logic and Memory: Combines 382,464 logic elements with approximately 28.3 Mbits of embedded RAM to minimize external memory requirements and simplify system architecture.
  • Broad Interface Support: 640 I/O pins provide flexibility to connect to multiple high-pin-count peripherals and parallel buses without extensive multiplexing.
  • Industrial Reliability: Rated for -40 °C to 100 °C operation, enabling deployment in temperature-challenging applications.
  • Compact, Surface-Mount Package: 1924-FCBGA (45×45) package supports high-density PCB layouts while maintaining manufacturability with surface-mount assembly.
  • Low-Voltage Core Compatibility: Core supply range of 950 mV to 1.05 V aligns with modern low-voltage power domains to optimize system power design.
  • Environmentally Compliant: RoHS compliance supports regulatory and environmental requirements for commercial and industrial products.

Why Choose XC6VHX380T-2FFG1924I?

The XC6VHX380T-2FFG1924I positions itself as a high-capacity, industrial-grade FPGA option for designs that demand extensive programmable logic, significant on-chip memory, and a high number of I/Os. Its combination of 382,464 logic elements, approximately 28.3 Mbits of embedded RAM, and 640 I/Os makes it suitable for complex data processing, communications, and industrial control applications.

With a surface-mount 1924-FCBGA package and operation from -40 °C to 100 °C, this device delivers a compact, robust platform for scalable designs that require substantial programmable resources while meeting industrial environmental requirements.

Request a quote or submit an RFQ to obtain pricing and availability for the XC6VHX380T-2FFG1924I and to discuss how it can fit into your next high-density FPGA design.

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