XC6VHX380T-2FFG1924I
| Part Description |
Virtex®-6 HXT Field Programmable Gate Array (FPGA) IC 640 28311552 382464 1924-BBGA, FCBGA |
|---|---|
| Quantity | 265 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1924-FCBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1924-BBGA, FCBGA | Number of I/O | 640 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 29880 | Number of Logic Elements/Cells | 382464 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28311552 |
Overview of XC6VHX380T-2FFG1924I – Virtex®-6 HXT Field Programmable Gate Array (FPGA), 1924-FCBGA
The XC6VHX380T-2FFG1924I is a Virtex-6 HXT Field Programmable Gate Array (FPGA) in a 1924-FCBGA package, designed for high-density programmable logic implementations. It combines large logic capacity, substantial on-chip memory, and a high I/O count in an industrial-grade, surface-mount form factor.
This device is suited to designs that require significant programmable resources—offering extensive logic elements, approximately 28.3 Mbits of embedded memory, and 640 I/O—while operating over an industrial temperature range and low-voltage core supply.
Key Features
- High Logic Capacity 382,464 logic elements to implement large-scale, complex digital designs.
- Embedded Memory Approximately 28.3 Mbits of on-chip RAM for buffering, caching, and local data storage.
- Extensive I/O 640 user I/O pins to support wide parallel interfaces and multiple external peripherals.
- Core Voltage Range Core supply voltage operating between 950 mV and 1.05 V to match system power domains.
- Industrial Temperature Range Specified operation from -40 °C to 100 °C for demanding environmental conditions.
- Package and Mounting 1924-FCBGA (45×45) package; surface-mount mounting type for compact board-level integration.
- RoHS Compliant Manufactured to meet RoHS environmental requirements.
Typical Applications
- Communications Infrastructure High I/O count and large logic capacity enable implementation of complex data-plane and control-plane functions.
- High-Performance Data Processing Large embedded memory and substantial logic resources support buffering, packet handling, and custom acceleration tasks.
- Industrial Control and Test Equipment Industrial-grade temperature range and robust packaging suit deployment in industrial environments requiring extended operating conditions.
Unique Advantages
- Highly Integrated Logic and Memory: Combines 382,464 logic elements with approximately 28.3 Mbits of embedded RAM to minimize external memory requirements and simplify system architecture.
- Broad Interface Support: 640 I/O pins provide flexibility to connect to multiple high-pin-count peripherals and parallel buses without extensive multiplexing.
- Industrial Reliability: Rated for -40 °C to 100 °C operation, enabling deployment in temperature-challenging applications.
- Compact, Surface-Mount Package: 1924-FCBGA (45×45) package supports high-density PCB layouts while maintaining manufacturability with surface-mount assembly.
- Low-Voltage Core Compatibility: Core supply range of 950 mV to 1.05 V aligns with modern low-voltage power domains to optimize system power design.
- Environmentally Compliant: RoHS compliance supports regulatory and environmental requirements for commercial and industrial products.
Why Choose XC6VHX380T-2FFG1924I?
The XC6VHX380T-2FFG1924I positions itself as a high-capacity, industrial-grade FPGA option for designs that demand extensive programmable logic, significant on-chip memory, and a high number of I/Os. Its combination of 382,464 logic elements, approximately 28.3 Mbits of embedded RAM, and 640 I/Os makes it suitable for complex data processing, communications, and industrial control applications.
With a surface-mount 1924-FCBGA package and operation from -40 °C to 100 °C, this device delivers a compact, robust platform for scalable designs that require substantial programmable resources while meeting industrial environmental requirements.
Request a quote or submit an RFQ to obtain pricing and availability for the XC6VHX380T-2FFG1924I and to discuss how it can fit into your next high-density FPGA design.

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