XC6VLX130T-1FF484I

IC FPGA 240 I/O 484FCBGA
Part Description

Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 240 9732096 128000 484-BBGA, FCBGA

Quantity 245 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGA, FCBGANumber of I/O240Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs10000Number of Logic Elements/Cells128000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits9732096

Overview of XC6VLX130T-1FF484I – Virtex®-6 LXT FPGA, 128,000 logic elements, 484-FCBGA

The XC6VLX130T-1FF484I is a Virtex®-6 LXT field programmable gate array (FPGA) in a 484-FCBGA package. It provides high logic capacity and significant on-chip memory for designs that require dense programmable logic, a substantial number of I/O signals, and operation across an industrial temperature range.

Designed for surface-mount applications, this industrial-grade device combines 128,000 logic elements, approximately 9.73 Mbits of embedded RAM, and up to 240 I/Os to support complex custom hardware implementations and system integration tasks.

Key Features

  • Core Logic  128,000 logic elements suitable for high-density programmable logic tasks and complex digital designs.
  • Embedded Memory  Approximately 9.73 Mbits of on-chip RAM to support large buffers, state machines, and memory-intensive functions.
  • Flexible I/O  Up to 240 I/O pins to interface with peripherals, sensors, and external logic within compact system designs.
  • Package & Mounting  484-ball FCBGA package (23 × 23) in a surface-mount form factor for dense board-level integration.
  • Power  Core supply range specified from 950 mV to 1.05 V to match system power architectures.
  • Temperature & Reliability  Industrial operating temperature range of −40°C to 100°C for reliable operation in demanding environments.
  • Environmental Compliance  RoHS compliant to meet standard environmental and manufacturing requirements.

Typical Applications

  • Industrial control systems — Leverages the industrial temperature rating and high I/O count for factory automation, motor control interfaces, and rugged monitoring equipment.
  • Communications and networking — Uses the high logic density and embedded RAM for protocol processing, packet buffering, and custom network functions.
  • Embedded prototyping and system integration — Provides ample logic and memory capacity for hardware validation, IP integration, and platform consolidation in development and production designs.
  • Custom hardware acceleration — Enables offloading and acceleration of compute-intensive algorithms using the device’s large logic fabric and on-chip memory.

Unique Advantages

  • High logic capacity: 128,000 logic elements support complex designs and large-scale IP integration, reducing the need for multiple devices.
  • Substantial on-chip memory: Approximately 9.73 Mbits of embedded RAM provides local storage for buffering, look-up tables, and state data without external memory dependence.
  • Generous I/O count: Up to 240 I/Os simplify board-level connectivity and minimize external interface circuitry.
  • Industrial robustness: −40°C to 100°C operating range enables deployment in temperature-challenging environments.
  • Compact FCBGA package: 484-ball (23 × 23) surface-mount package balances high pin count with space-efficient board footprint.
  • RoHS compliant: Supports environmental and manufacturing compliance requirements.

Why Choose XC6VLX130T-1FF484I?

The XC6VLX130T-1FF484I positions itself as an industrial-grade FPGA choice where high logic density, significant embedded memory, and extensive I/O are required in a compact surface-mount package. Its combination of 128,000 logic elements, approximately 9.73 Mbits of on-chip RAM, and support for up to 240 I/Os makes it suitable for system designers looking to consolidate functionality and manage board-level complexity.

This device is well suited to teams developing industrial equipment, communication systems, or custom hardware accelerators that require a robust operating temperature range and RoHS compliance. Its package and power characteristics support integration into a variety of surface-mount designs while keeping scalability and long-term deployment considerations in mind.

Request a quote or submit a procurement inquiry to discuss availability, pricing, and lead times for the XC6VLX130T-1FF484I. Our team can provide the details you need to move your design forward.

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