XC6VLX130T-1FF484I
| Part Description |
Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 240 9732096 128000 484-BBGA, FCBGA |
|---|---|
| Quantity | 245 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA, FCBGA | Number of I/O | 240 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 10000 | Number of Logic Elements/Cells | 128000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9732096 |
Overview of XC6VLX130T-1FF484I – Virtex®-6 LXT FPGA, 128,000 logic elements, 484-FCBGA
The XC6VLX130T-1FF484I is a Virtex®-6 LXT field programmable gate array (FPGA) in a 484-FCBGA package. It provides high logic capacity and significant on-chip memory for designs that require dense programmable logic, a substantial number of I/O signals, and operation across an industrial temperature range.
Designed for surface-mount applications, this industrial-grade device combines 128,000 logic elements, approximately 9.73 Mbits of embedded RAM, and up to 240 I/Os to support complex custom hardware implementations and system integration tasks.
Key Features
- Core Logic 128,000 logic elements suitable for high-density programmable logic tasks and complex digital designs.
- Embedded Memory Approximately 9.73 Mbits of on-chip RAM to support large buffers, state machines, and memory-intensive functions.
- Flexible I/O Up to 240 I/O pins to interface with peripherals, sensors, and external logic within compact system designs.
- Package & Mounting 484-ball FCBGA package (23 × 23) in a surface-mount form factor for dense board-level integration.
- Power Core supply range specified from 950 mV to 1.05 V to match system power architectures.
- Temperature & Reliability Industrial operating temperature range of −40°C to 100°C for reliable operation in demanding environments.
- Environmental Compliance RoHS compliant to meet standard environmental and manufacturing requirements.
Typical Applications
- Industrial control systems — Leverages the industrial temperature rating and high I/O count for factory automation, motor control interfaces, and rugged monitoring equipment.
- Communications and networking — Uses the high logic density and embedded RAM for protocol processing, packet buffering, and custom network functions.
- Embedded prototyping and system integration — Provides ample logic and memory capacity for hardware validation, IP integration, and platform consolidation in development and production designs.
- Custom hardware acceleration — Enables offloading and acceleration of compute-intensive algorithms using the device’s large logic fabric and on-chip memory.
Unique Advantages
- High logic capacity: 128,000 logic elements support complex designs and large-scale IP integration, reducing the need for multiple devices.
- Substantial on-chip memory: Approximately 9.73 Mbits of embedded RAM provides local storage for buffering, look-up tables, and state data without external memory dependence.
- Generous I/O count: Up to 240 I/Os simplify board-level connectivity and minimize external interface circuitry.
- Industrial robustness: −40°C to 100°C operating range enables deployment in temperature-challenging environments.
- Compact FCBGA package: 484-ball (23 × 23) surface-mount package balances high pin count with space-efficient board footprint.
- RoHS compliant: Supports environmental and manufacturing compliance requirements.
Why Choose XC6VLX130T-1FF484I?
The XC6VLX130T-1FF484I positions itself as an industrial-grade FPGA choice where high logic density, significant embedded memory, and extensive I/O are required in a compact surface-mount package. Its combination of 128,000 logic elements, approximately 9.73 Mbits of on-chip RAM, and support for up to 240 I/Os makes it suitable for system designers looking to consolidate functionality and manage board-level complexity.
This device is well suited to teams developing industrial equipment, communication systems, or custom hardware accelerators that require a robust operating temperature range and RoHS compliance. Its package and power characteristics support integration into a variety of surface-mount designs while keeping scalability and long-term deployment considerations in mind.
Request a quote or submit a procurement inquiry to discuss availability, pricing, and lead times for the XC6VLX130T-1FF484I. Our team can provide the details you need to move your design forward.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








