XC6VLX130T-1FF784C

The XC6VLX130T-1FF784C is a Virtex®-6 LXT Field Programmable Gate Array (FPGA) from AMD that delivers high programmable logic capacity and substantial on-chip memory. It combines a large logic element count with a high I/O count and a compact 784-FCBGA package for dense system integration.

Targeted at designs that require extensive embedded logic, significant embedded RAM, and multi-pin interfacing, this commercial-grade device supports a core supply range of 950 mV to 1.05 V and operates between 0 °C and 85 °C.

Key Features

• Core Capacity 128,000 logic elements provide extensive programmable logic resources for complex designs; device data also lists 10,000 CLBs for logic fabric reference.
• Embedded Memory Approximately 9.73 Mbits of total on-chip RAM for buffering, state storage, and intermediate data processing without requiring external memory.
• I/O Resources 400 I/O pins to support wide external interfacing and parallel connectivity needs.
• Power Supply Core voltage supply range of 950 mV to 1.05 V to match system power-rail requirements.
• Package & Mounting 784-BBGA (supplier package: 784-FCBGA, 29 × 29 mm) in a surface-mount ball-grid array for compact board-level integration.
• Operating Conditions & Compliance Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• High-density programmable logic — For designs requiring up to 128,000 logic elements and substantial on-chip memory for complex functions and custom accelerators.
• I/O-intensive systems — Suitable where up to 400 external I/Os are needed for parallel interfaces, multi-channel connectivity, or board-level aggregation.
• Embedded memory-centric designs — Use the approximately 9.73 Mbits of embedded RAM for buffering, packet processing, or intermediate data storage to reduce dependence on external memory.

Unique Advantages

• High programmable density: 128,000 logic elements enable large-scale logic implementation without immediate subdivision across multiple devices.
• Substantial on-chip RAM: Approximately 9.73 Mbits of embedded memory supports complex state machines and data buffering within the FPGA fabric.
• Generous I/O count: 400 I/Os provide flexibility for wide parallel interfaces and multi-channel designs, reducing the need for additional interface ICs.
• Compact BGA package: 784-FCBGA (29 × 29 mm) allows dense board-level placement while preserving routing options for high-pin-count designs.
• Commercial-grade operating range: Rated for 0 °C to 85 °C and RoHS compliant for standard commercial product life-cycle requirements.

Why Choose XC6VLX130T-1FF784C?

The XC6VLX130T-1FF784C positions itself as a high-capacity, commercially graded FPGA option from AMD, combining 128,000 logic elements, approximately 9.73 Mbits of embedded RAM, and 400 I/Os in a 784-FCBGA package. This combination supports dense, memory-aware designs that require significant programmable logic and connectivity while maintaining a compact board footprint.

Choose this device for projects that demand large on-chip resources and a high pin count in a commercially rated FPGA, offering a balance of integration, power supply compatibility, and RoHS compliance for mainstream embedded designs.

Request a quote or submit an inquiry to obtain pricing and availability for the XC6VLX130T-1FF784C.