XC6VLX130T-1FFG484I

The XC6VLX130T-1FFG484I is a Virtex®-6 LXT FPGA IC from AMD, offered in a 484-BBGA package with a 23×23 supplier device footprint. It provides a high-capacity programmable fabric with 128,000 logic elements and approximately 9.7 Mbits of embedded memory to support complex digital design integration.

Designed for industrial-grade deployments, this surface-mount FPGA supports up to 240 I/O and operates over a wide supply and temperature range, enabling robust integration into demanding embedded systems.

Key Features

• Core Capacity 128,000 logic elements provide substantial programmable resources for implementing complex logic, custom processors, and system-level integration.
• Embedded Memory Approximately 9.7 Mbits of on-chip RAM for buffering, lookup tables, and local data storage to support high-throughput processing tasks.
• I/O Resources Up to 240 I/O pins to support a wide range of external interfaces and parallel connectivity requirements.
• Package & Mounting 484-BBGA package (supplier device package: 484-FBGA, 23×23) in a surface-mount form factor for compact board-level integration.
• Power Core supply range of 950 mV to 1.05 V to match common FPGA power domains.
• Temperature & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance RoHS compliant, meeting common lead-free and hazardous-substance requirements for electronics manufacturing.

Typical Applications

• High-density digital processing Implement complex custom accelerators and signal processing pipelines using 128,000 logic elements and substantial on-chip RAM.
• Multi-channel interfacing Support parallel data paths and numerous external peripherals with up to 240 I/O pins in a compact FBGA package.
• Industrial control and automation Industrial-grade temperature range (−40 °C to 100 °C) and robust packaging make the device suitable for embedded control systems and factory automation.

Unique Advantages

• High logic density: 128,000 logic elements enable consolidation of multiple functions into a single device, reducing overall system complexity.
• Significant on-chip memory: Approximately 9.7 Mbits of embedded RAM minimizes external memory dependence and improves data locality for performance-sensitive designs.
• Broad I/O capability: 240 I/O pins provide flexibility for interfacing to multiple peripherals, sensors, and high-speed data paths.
• Industrial-rated operation: Specified for −40 °C to 100 °C operation to meet the needs of temperature-demanding applications.
• Compact surface-mount package: 484-BBGA (23×23) offers a small footprint for board-space-constrained designs while maintaining high pin count.
• Regulatory readiness: RoHS compliance supports lead-free assembly and regulatory requirements for commercial production.

Why Choose XC6VLX130T-1FFG484I?

The XC6VLX130T-1FFG484I combines a large programmable fabric, significant embedded memory, and a high I/O count in an industrial-grade 484-BBGA surface-mount package. Its supply voltage range and operating temperature specification allow reliable integration into demanding embedded systems where consolidation of digital functions is required.

This part is well suited to designers and engineers seeking a scalable, high-capacity FPGA platform for complex logic implementation, data-path acceleration, and multi-interface systems while maintaining compliance with environmental manufacturing standards.

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