XC6VLX130T-2FF1156I

The XC6VLX130T-2FF1156I is a Virtex®-6 LXT FPGA IC from AMD designed for high-density, I/O-rich logic implementations. It combines a large logic fabric with substantial embedded memory and broad I/O support in a surface-mount 1156-BBGA/FCBGA package.

Key attributes include 128,000 logic elements, approximately 9.73 Mbits of embedded memory, 600 user I/O pins, industrial-grade operation, and a core supply range of 950 mV to 1.05 V—making it suitable for designs that require high logic capacity, extensive interfacing, and wide operating temperature support.

Key Features

• Core Logic 128,000 logic elements provide a large programmable fabric for complex digital designs and parallel processing tasks.
• Embedded Memory Approximately 9.73 Mbits of on-chip RAM support buffering, state storage, and memory-intensive logic functions without immediate external memory dependence.
• High I/O Count 600 user I/O pins enable extensive external interfacing for multi-channel data paths, peripherals, and system-level connectivity.
• Package Available in a 1156-BBGA / 1156-FCBGA supplier device package (1156-FCBGA (35x35)) suitable for dense board-level integration and surface-mount assembly.
• Power Core voltage supply range from 950 mV to 1.05 V supports system power planning and voltage rail design.
• Temperature & Grade Industrial grade with an operating temperature range of -40 °C to 100 °C to meet demanding environmental conditions.
• Regulatory RoHS compliant for compatibility with lead-free manufacturing and environmental requirements.

Typical Applications

• High-density logic implementations Use the large logic element count for complex state machines, protocol processing, or parallel compute kernels.
• Memory-intensive functions Leverage approximately 9.73 Mbits of embedded RAM for buffering, packet queues, and on-chip data storage.
• I/O-rich system interfaces Employ 600 I/O pins to connect multiple peripherals, transceivers, or external buses in systems requiring broad connectivity.
• Industrial embedded systems Industrial-grade temperature range and surface-mount packaging make it suitable for embedded applications operating across -40 °C to 100 °C.

Unique Advantages

• Highly integrated logic and memory: Combines 128,000 logic elements with substantial on-chip RAM to reduce reliance on external components and simplify board design.
• Extensive external interfacing: 600 I/O pins provide flexibility to support multiple interfaces and parallel data channels without extensive multiplexing.
• Industrial temperature capability: Rated for -40 °C to 100 °C operation to support deployment in thermally demanding environments.
• Compact surface-mount package: 1156-BBGA/FCBGA packaging enables high-density PCB layouts while supporting robust mechanical mounting.
• Predictable power planning: A defined core supply range of 950 mV to 1.05 V aids in power-rail design and system integration.
• RoHS compliance: Meets lead-free manufacturing requirements for contemporary production environments.

Why Choose XC6VLX130T-2FF1156I?

The XC6VLX130T-2FF1156I positions itself as a high-capacity Virtex®-6 LXT FPGA offering a balance of large programmable logic, embedded memory, and broad I/O in a surface-mount 1156-BBGA/FCBGA package. Its industrial-grade temperature range and RoHS compliance make it a practical choice for embedded designs that demand robust thermal performance and modern manufacturing compatibility.

This device is well suited for engineers and procurement teams targeting designs that need significant on-chip resources and extensive external interfacing while maintaining a compact board footprint and predictable power requirements.

Request a quote or submit an inquiry to discuss availability, pricing, and how the XC6VLX130T-2FF1156I can fit your next high-density FPGA design.