XC6VLX130T-2FFG1156I

The XC6VLX130T-2FFG1156I is a Virtex®-6 LXT field programmable gate array IC delivering large logic capacity, extensive I/O and substantial on-chip memory. Its specification set — including 128,000 logic elements, approximately 9.73 Mbits of embedded memory and 600 I/O pins — targets designs that require high logic density and significant I/O integration within an industrial temperature range.

Packaged in a 1156-FCBGA (35×35) surface-mount package and rated for industrial operation, this device provides a combination of logic, memory and I/O resources for embedded and board-level system designs.

Key Features

• Core / Logic Capacity 128,000 logic elements (logic cells) to implement high-density digital functions and complex logic designs.
• Embedded Memory Approximately 9.73 Mbits of on-chip RAM to support buffering, state storage and local data processing without external memory.
• I/O Resources Up to 600 I/O pins to support wide interfacing options and multiple parallel connections to external peripherals and subsystems.
• Power Supply Core voltage supply range of 0.95 V to 1.05 V for compatibility with defined core-power domains.
• Package & Mounting 1156-BBGA / 1156-FCBGA (35×35) package in a surface-mount form factor for board-level integration where a high pin-count BGA is required.
• Temperature & Grade Industrial grade device with an operating temperature range of −40 °C to 100 °C for deployment in temperature-demanding environments.
• Environmental Compliance RoHS compliant to meet common lead-free manufacturing and regulatory requirements.

Typical Applications

• Industrial Systems Use in industrial equipment and control systems where industrial-grade components and a −40 °C to 100 °C operating range are required.
• High I/O Embedded Designs Integration into embedded systems that require up to 600 I/O pins for interfacing sensors, actuators or peripheral subsystems.
• Complex Logic and Data Processing Implementation of substantial logic functions and local buffering using 128,000 logic elements and approximately 9.73 Mbits of on-chip RAM.

Unique Advantages

• High logic density: 128,000 logic elements enable consolidation of complex functions into a single device, reducing external component count.
• Significant on-chip memory: Approximately 9.73 Mbits of embedded RAM supports local data storage and buffering to streamline system memory architecture.
• Extensive I/O capability: 600 I/O pins provide flexibility for multi-channel interfaces and parallel peripheral connections.
• Industrial temperature range: Rated from −40 °C to 100 °C and classified as industrial grade for use in temperature-challenging deployments.
• High-pin-count package: 1156-FCBGA (35×35) surface-mount package enables dense board-level integration with a large number of signals.
• RoHS compliant: Meets lead-free requirements for environments requiring RoHS conformity.

Why Choose XC6VLX130T-2FFG1156I?

The XC6VLX130T-2FFG1156I offers a combination of high logic capacity, substantial embedded memory and a large I/O complement in a single industrial-grade BGA package. These attributes make it well suited for designs that need integrated logic and memory resources alongside extensive interfacing while operating across a wide temperature range.

For engineers and procurement teams building systems that demand dense digital capability and robust environmental performance, this Virtex®-6 LXT FPGA provides a balance of integration and board-level flexibility with verifiable specifications for logic, memory, I/O, packaging and operating conditions.

Request a quote or submit a pricing inquiry for the XC6VLX130T-2FFG1156I to evaluate availability and obtain ordering information tailored to your project needs.