XC6VLX130T-2FFG1156C

The XC6VLX130T-2FFG1156C is a Virtex-6 LXT field programmable gate array (FPGA) supplied in a 1156-ball FCBGA package. It delivers a high on-chip logic capacity and substantial embedded memory combined with a large I/O count for complex, programmable digital designs.

Designed for commercial-grade systems, this surface-mount FPGA targets applications that require large-scale logic integration, abundant RAM resources, and extensive I/O connectivity while operating within a 0 °C to 85 °C temperature range.

Key Features

• Logic Capacity — 128,000 logic elements to implement complex, high-density digital functions and custom architectures.
• Embedded Memory — Approximately 9.73 Mbits of on-chip RAM for buffering, look-up tables, and embedded data storage.
• I/O — Up to 600 user I/O pins to support wide parallel interfaces, high-channel counts, and multiple bus connections.
• Power Supply — Core supply range of 0.95–1.05 V to match system power-rail requirements.
• Package & Mounting — 1156-ball FCBGA package (1156-FCBGA, 35×35 mm) in a surface-mount form factor for board-level integration.
• Operating Range & Grade — Commercial grade operation specified from 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-density digital systems — Implement large-scale programmable logic and custom processing pipelines using the FPGA’s 128,000 logic elements and embedded memory.
• Multi-channel I/O aggregation — Use the 600 I/O pins for parallel data acquisition, protocol bridging, or aggregating multiple serial channels.
• Embedded memory buffering — Leverage approximately 9.73 Mbits of on-chip RAM for packet buffering, frame storage, and intermediate data staging.

Unique Advantages

• High on-chip logic density: 128,000 logic elements enable implementation of complex algorithms and large custom datapaths without external logic.
• Substantial embedded RAM: Approximately 9.73 Mbits of memory reduces dependence on external DRAM for many buffering and storage needs.
• Extensive I/O availability: 600 user I/Os support broad interfacing options and simplify board-level routing for multi-channel designs.
• Compact surface-mount package: The 1156-FCBGA (35×35 mm) package allows dense board integration while keeping signal pin count high.
• Commercial-grade operating range: Specified 0 °C to 85 °C operation suitable for a wide range of non-industrial applications.
• RoHS compliant: Conforms to environmental regulations for lead-free assembly and global product acceptance.

Why Choose XC6VLX130T-2FFG1156C?

The XC6VLX130T-2FFG1156C balances large logic capacity, significant on-chip RAM, and a high I/O count in a single commercial-grade FCBGA package. It is well suited to designs that require substantial programmable logic resources and dense I/O without adding external memory or glue logic where possible.

For engineers targeting scalable, high-density programmable designs that must meet commercial temperature and RoHS requirements, this Virtex-6 LXT FPGA offers a compact, integrated solution that simplifies board-level implementation while providing the resources needed for complex digital systems.

Request a quote or submit an inquiry to receive pricing and availability information for the XC6VLX130T-2FFG1156C for your next design.