XC6VLX130T-1FFG784I

The XC6VLX130T-1FFG784I is a Virtex®-6 LXT field programmable gate array from AMD, supplied in a 784-ball FCBGA package. It integrates a large programmable fabric with 128,000 logic elements and approximately 9.73 Mbits of on-chip RAM in a surface-mount industrial-grade device.

Designed for designs that require high I/O count and substantial embedded memory, this device offers 400 I/O pins, a core voltage range of 0.95 V to 1.05 V, and an operating temperature range of −40 °C to 100 °C.

Key Features

• Programmable Logic Capacity — 128,000 logic elements provide extensive resources for custom digital designs and complex logic integration.
• Embedded Memory — Approximately 9.73 Mbits of on-chip RAM supports buffering, LUT storage, and embedded storage requirements without immediate reliance on external memory.
• High I/O Count — 400 general-purpose I/O pins enable dense peripheral connectivity and flexible interfacing options.
• Package and Mounting — 784-BBGA (784-FCBGA, 29 × 29 mm) surface-mount package delivers a compact, high-density footprint for PCB-level integration.
• Power — Core supply voltage range of 0.95 V to 1.05 V allows defined power delivery planning for the FPGA core.
• Industrial Temperature Range — Rated to operate from −40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant — Conforms to RoHS requirements for lead-free assembly and environmental compliance.

Unique Advantages

• High integration density: Large logic element count and substantial on-chip RAM reduce the need for multiple discrete components, simplifying PCB design.
• Extensive I/O availability: 400 I/O pins support complex system interfacing and multiple parallel connections.
• Compact packaging: 784-FCBGA (29 × 29 mm) package provides high pin count in a manageable board footprint for space-constrained designs.
• Industrial operating range: Specified −40 °C to 100 °C supports deployment in a wide range of environmental conditions.
• Defined power envelope: Narrow core voltage range (0.95 V–1.05 V) assists predictable power-supply design and margin planning.
• Regulatory alignment: RoHS compliance facilitates use in assemblies targeting lead-free manufacturing processes.

Why Choose XC6VLX130T-1FFG784I?

The XC6VLX130T-1FFG784I combines a high count of logic elements with substantial on-chip memory and a large I/O complement in an industrial-grade FCBGA package. It is suited to projects that require significant programmable resources, dense external connectivity, and a defined electrical and thermal operating window.

This device is appropriate for engineering teams and procurement looking for a scalable FPGA platform with clear hardware specifications—logic capacity, embedded memory, I/O count, package details, power requirements, and operating temperature—backed by AMD's Virtex-6 family support ecosystem.

Request a quote or submit an inquiry for pricing and availability to begin integration planning with the XC6VLX130T-1FFG784I.