XC6VLX130T-1FFG484C

IC FPGA 240 I/O 484FBGA
Part Description

Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 240 9732096 128000 484-BBGA

Quantity 392 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O240Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs10000Number of Logic Elements/Cells128000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits9732096

Overview of XC6VLX130T-1FFG484C – Virtex®-6 LXT FPGA, 128,000 logic elements, 484‑BBGA

The XC6VLX130T-1FFG484C is a Virtex®-6 LXT field programmable gate array (FPGA) IC produced by AMD. It delivers a high logic capacity combined with significant on-chip RAM and a large I/O complement for complex programmable logic designs.

Key device characteristics include 128,000 logic elements, approximately 9.73 Mbits of embedded memory, 240 I/O pins, a 484‑BBGA package, commercial-grade operating range (0°C to 85°C), and RoHS compliance.

Key Features

  • Core Architecture Virtex®-6 LXT field programmable gate array (FPGA) architecture in the XC6VLX130T-1FFG484C part.
  • Logic Capacity 128,000 logic elements to implement large-scale combinational and sequential logic functions.
  • Embedded Memory Approximately 9.73 Mbits of on-chip RAM for buffering, FIFOs, and memory-intensive logic functions.
  • I/O 240 user I/O pins to support broad interface and connectivity requirements.
  • Power Core supply specified in the 0.95–1.05 V range for predictable power budgeting.
  • Package & Mounting 484‑BBGA package (supplier device package: 484‑FBGA, 23×23) with surface-mount mounting type for compact board integration.
  • Operating Range & Grade Commercial grade operation from 0°C to 85°C and RoHS‑compliant construction.

Unique Advantages

  • High logic density: 128,000 logic elements enable complex, high-capacity designs without immediate need for multi-chip partitioning.
  • Substantial embedded memory: Approximately 9.73 Mbits of on-chip RAM supports large buffering and local data storage, reducing external memory dependence.
  • Generous I/O count: 240 I/O pins provide flexibility for interfacing multiple peripherals, buses, and custom I/O standards.
  • Predictable power window: Core supply range of 0.95–1.05 V assists in power planning and supply selection for system designers.
  • Compact, industry-standard package: 484‑BBGA / 484‑FBGA (23×23) surface-mount package simplifies PCB layout for dense system designs.
  • Commercial-grade reliability and compliance: Rated for 0°C to 85°C operation and RoHS compliant for standard commercial applications.

Why Choose XC6VLX130T-1FFG484C?

The XC6VLX130T-1FFG484C positions itself as a high-capacity Virtex®-6 LXT FPGA option, combining 128,000 logic elements with approximately 9.73 Mbits of embedded memory and 240 I/O. Its 484‑BBGA package and surface-mount form factor make it suitable for compact, high-density board designs requiring significant programmable logic resources.

Manufactured by AMD and provided as a commercial-grade, RoHS-compliant device, this FPGA is appropriate for designers seeking robust logic density, substantial on-chip memory, and a clear electrical and thermal operating envelope for standard commercial applications.

Request a quote or submit an inquiry to receive pricing and availability information for XC6VLX130T-1FFG484C.

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