XC6VLX130T-1FFG484C
| Part Description |
Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 240 9732096 128000 484-BBGA |
|---|---|
| Quantity | 392 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 240 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 10000 | Number of Logic Elements/Cells | 128000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9732096 |
Overview of XC6VLX130T-1FFG484C – Virtex®-6 LXT FPGA, 128,000 logic elements, 484‑BBGA
The XC6VLX130T-1FFG484C is a Virtex®-6 LXT field programmable gate array (FPGA) IC produced by AMD. It delivers a high logic capacity combined with significant on-chip RAM and a large I/O complement for complex programmable logic designs.
Key device characteristics include 128,000 logic elements, approximately 9.73 Mbits of embedded memory, 240 I/O pins, a 484‑BBGA package, commercial-grade operating range (0°C to 85°C), and RoHS compliance.
Key Features
- Core Architecture Virtex®-6 LXT field programmable gate array (FPGA) architecture in the XC6VLX130T-1FFG484C part.
- Logic Capacity 128,000 logic elements to implement large-scale combinational and sequential logic functions.
- Embedded Memory Approximately 9.73 Mbits of on-chip RAM for buffering, FIFOs, and memory-intensive logic functions.
- I/O 240 user I/O pins to support broad interface and connectivity requirements.
- Power Core supply specified in the 0.95–1.05 V range for predictable power budgeting.
- Package & Mounting 484‑BBGA package (supplier device package: 484‑FBGA, 23×23) with surface-mount mounting type for compact board integration.
- Operating Range & Grade Commercial grade operation from 0°C to 85°C and RoHS‑compliant construction.
Unique Advantages
- High logic density: 128,000 logic elements enable complex, high-capacity designs without immediate need for multi-chip partitioning.
- Substantial embedded memory: Approximately 9.73 Mbits of on-chip RAM supports large buffering and local data storage, reducing external memory dependence.
- Generous I/O count: 240 I/O pins provide flexibility for interfacing multiple peripherals, buses, and custom I/O standards.
- Predictable power window: Core supply range of 0.95–1.05 V assists in power planning and supply selection for system designers.
- Compact, industry-standard package: 484‑BBGA / 484‑FBGA (23×23) surface-mount package simplifies PCB layout for dense system designs.
- Commercial-grade reliability and compliance: Rated for 0°C to 85°C operation and RoHS compliant for standard commercial applications.
Why Choose XC6VLX130T-1FFG484C?
The XC6VLX130T-1FFG484C positions itself as a high-capacity Virtex®-6 LXT FPGA option, combining 128,000 logic elements with approximately 9.73 Mbits of embedded memory and 240 I/O. Its 484‑BBGA package and surface-mount form factor make it suitable for compact, high-density board designs requiring significant programmable logic resources.
Manufactured by AMD and provided as a commercial-grade, RoHS-compliant device, this FPGA is appropriate for designers seeking robust logic density, substantial on-chip memory, and a clear electrical and thermal operating envelope for standard commercial applications.
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