XC6VLX130T-1FFG784C

The XC6VLX130T-1FFG784C is a Virtex®-6 LXT Field Programmable Gate Array (FPGA) supplied in a 784-ball FCBGA package. It delivers high logic density with 128,000 logic elements, approximately 9.73 Mbits of on-chip RAM, and 400 user I/Os in a surface-mount 784-FCBGA (29×29) package.

Designed for commercial-grade applications, the device operates from 0.95 V to 1.05 V and is rated for an operating temperature range of 0 °C to 85 °C. The product is RoHS compliant.

Key Features

• Core density — 128,000 logic elements and 10,000 CLBs for implementing complex digital logic and control functions.
• Embedded memory — Approximately 9.73 Mbits (9,732,096 bits) of on-chip RAM to support data buffering, state machines, and embedded storage needs.
• I/O capability — 400 user I/Os to support a wide range of peripheral interfaces and multi-channel signal routing.
• Power supply — Operates from 0.95 V to 1.05 V, enabling predictable core power planning in system designs.
• Package & mounting — 784-FCBGA (29×29) surface-mount package (784-BBGA, FCBGA) for high pin density in a compact footprint.
• Temperature & grade — Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental compliance — RoHS compliant.

Unique Advantages

• High logic capacity: 128,000 logic elements provide substantial room for integrating complex algorithms and control logic on a single device.
• Significant on-chip RAM: Approximately 9.73 Mbits of embedded memory reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O count: 400 user I/Os enable flexible interfacing to multiple sensors, peripherals, and high-pin-count designs.
• High-density package: 784-FCBGA (29×29) delivers high pin count in a compact form factor for space-constrained boards.
• Commercial temperature rating: Rated 0 °C to 85 °C to meet standard commercial product requirements.
• Regulatory readiness: RoHS compliance supports environmentally conscious product development.

Why Choose XC6VLX130T-1FFG784C?

The XC6VLX130T-1FFG784C positions itself as a high-density, commercial-grade FPGA option with a balance of logic capacity, embedded memory, and I/O resources packaged in a 784-FCBGA surface-mount package. Its electrical and thermal ratings make it suitable for designs that require substantial on-chip logic and memory while operating within standard commercial temperature ranges.

This device is appropriate for engineering teams and product designs that need a single-chip solution offering a large number of logic elements, nearly 9.73 Mbits of embedded RAM, and up to 400 I/Os—supporting integration, reduced external component count, and compact board layouts.

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