XC6VLX130T-1FFG1156C

The XC6VLX130T-1FFG1156C is a Virtex®-6 LXT field programmable gate array (FPGA) from AMD supplied in a 1156-FCBGA package. It combines high logic density with substantial on-chip memory and a large I/O count in a surface-mount FCBGA footprint.

Designed for applications that require significant programmable logic and embedded RAM, this device offers 128,000 logic elements, approximately 9.7 Mbits of embedded memory, and 600 I/O pins, along with low-voltage core operation and commercial temperature grading.

Key Features

• Core Logic  128,000 logic elements provide a large programmable fabric for complex digital designs.
• Embedded Memory  Approximately 9.7 Mbits of on-chip RAM to support data buffering, state storage, and memory-intensive algorithms.
• I/O Capacity  600 user I/O pins enable wide external interfacing and high parallel connectivity.
• Power  Core voltage supply range of 950 mV to 1.05 V for standard Virtex-6 LXT core operation.
• Package & Mounting  1156-FCBGA (1156-BBGA) package, supplier device package 1156-FCBGA (35×35), surface mount for compact board-level integration.
• Temperature & Compliance  Commercial operating temperature range of 0 °C to 85 °C and RoHS compliance.

Unique Advantages

• High logic density: 128,000 logic elements enable implementation of complex custom logic without external ASICs.
• Substantial on-chip memory: Approximately 9.7 Mbits of embedded RAM reduces dependence on external memory and simplifies board design.
• Extensive I/O: 600 I/O pins support broad connectivity and parallel data paths for demanding I/O requirements.
• Compact FCBGA package: 1156-FCBGA (35×35) keeps board footprint compact while providing high pin count.
• Low-voltage core operation: 950 mV to 1.05 V supply range supports standard Virtex-6 power architectures.
• RoHS compliant: Meets environmental routing requirements for lead-free assembly.

Why Choose XC6VLX130T-1FFG1156C?

The XC6VLX130T-1FFG1156C positions itself as a high-capacity programmable logic device that balances substantial logic resources, sizable embedded memory, and a high I/O count in a single compact FCBGA package. Its electrical and thermal specifications—950 mV to 1.05 V core voltage and a 0 °C to 85 °C operating range—make it suitable for commercial-grade designs requiring dense programmable logic and significant on-chip RAM.

This FPGA is well suited for design teams needing a scalable, high-density programmable platform with extensive I/O and compact board-level integration. Its combination of features provides long-term hardware flexibility for evolving digital designs that rely on integrated logic capacity and memory.

Request a quote or submit an inquiry to receive pricing and availability information for the XC6VLX130T-1FFG1156C. Our team will respond with the next steps to procure this Virtex®-6 LXT FPGA.