XC6VLX130T-1FF1156I

The XC6VLX130T-1FF1156I is a Virtex®-6 LXT field programmable gate array (FPGA) IC manufactured by AMD. It provides a high logic capacity device with a large I/O count and substantial embedded RAM, targeted at designs that require dense logic resources and extensive external interfacing.

Key value propositions include high integration of logic and on-chip memory, a compact 1156-FCBGA package, low core-voltage operation, and industrial-grade temperature capability for designs operating from −40 °C to 100 °C.

Key Features

• Logic Capacity — 128,000 logic elements for implementing complex digital designs and large-scale logic functions.
• Embedded Memory — Approximately 9.73 Mbits of embedded memory (total RAM bits: 9,732,096) to support buffering, FIFOs, and on-chip data storage.
• I/O Density — 600 I/O pins to accommodate numerous external interfaces and parallel connections.
• Core Voltage — Low-voltage core supply range from 950 mV to 1.05 V for modern FPGA core power domains.
• Package & Mounting — 1156-BBGA / 1156-FCBGA (35×35) surface-mount package for high-density board integration.
• Operating Temperature — Industrial-grade operation from −40 °C to 100 °C for elevated environmental tolerance.
• Regulatory — RoHS compliant.

Typical Applications

• High-density logic designs — Implement complex state machines, custom processing pipelines, or large-scale combinational and sequential logic using 128,000 logic elements.
• Memory-intensive functions — Use approximately 9.73 Mbits of embedded memory for data buffering, packet queues, and on-chip storage.
• High I/O interfacing — Systems requiring many external connections and parallel interfaces benefit from the 600 available I/Os.
• Industrial systems — Suitable for designs that require operation across −40 °C to 100 °C and the reliability associated with industrial-grade components.

Unique Advantages

• Highly integrated logic and memory: Combine 128,000 logic elements with approximately 9.73 Mbits of embedded RAM to reduce external component count and simplify board-level architecture.
• Large I/O capacity: 600 I/Os enable complex interface aggregation and flexible connectivity options without multiplexing compromises.
• Compact, high-density package: The 1156-FCBGA (35×35) surface-mount package delivers high pin-count in a compact footprint for space-constrained PCBs.
• Low-voltage core operation: Core supply range of 950 mV to 1.05 V aligns with low-power FPGA core domains.
• Industrial temperature range: Specified for −40 °C to 100 °C operation to support demanding environmental deployments.
• RoHS compliant: Conforms to RoHS requirements for restricted substances.

Why Choose XC6VLX130T-1FF1156I?

The XC6VLX130T-1FF1156I positions itself as a high-capacity, industrial-grade FPGA option within the Virtex®-6 LXT family from AMD, offering a balanced combination of large logic resources, substantial embedded memory, and a high I/O count in a compact FCBGA package. Its low-voltage core and extended temperature range make it suitable for robust, long-lived designs that require both density and environmental tolerance.

This device is well suited to engineers and teams designing systems that need significant on-chip logic and memory integration, extensive external interfacing, and industrial temperature performance while maintaining a compact board footprint.

If you would like pricing or availability, request a quote or submit an inquiry to receive a formal quotation and lead-time information for the XC6VLX130T-1FF1156I.