XC6VHX380T-3FFG1155C

The XC6VHX380T-3FFG1155C is a Virtex®-6 HXT field programmable gate array (FPGA) IC from AMD. It provides a high density of programmable logic, extensive on-chip memory, and a large I/O complement in a 1156-ball FCBGA package.

With 382,464 logic elements, approximately 28.3 Mbits of embedded memory and 440 I/O, this device is designed for designs that require significant programmable resources and high pin count while operating within a commercial temperature range.

Key Features

• Core Logic  382,464 logic elements for implementing large-scale programmable logic functions and complex digital architectures.
• Embedded Memory  Approximately 28.3 Mbits of on-chip RAM, enabling substantial data buffering, packet storage, and state memory without external memory for many use cases.
• I/O Capacity  440 I/O pins to support high-pin-count interfaces and dense connectivity to peripherals, transceivers, and daughter cards.
• Package & Mounting  1156-ball FCBGA package (1156-BBGA, supplier device package 1156-FCBGA 35×35) in a surface-mount format for compact board-level integration.
• Power  Core voltage supply range of 950 mV to 1.05 V to match system power rails and regulator designs.
• Temperature & Grade  Commercial grade operation with an operating temperature range of 0 °C to 85 °C for standard commercial applications.
• Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-density digital processing  Use the large logic capacity and on-chip memory for complex signal processing, protocol handling, or custom compute pipelines.
• Telecommunications and networking  Leverage the high I/O count and embedded RAM for packet buffering, interface aggregation, and protocol conversion at board level.
• Data acquisition and instrumentation  Implement multi-channel data collection, preprocessing, and buffering using abundant logic and memory resources.
• System prototyping and emulation  Deploy the device where a high number of programmable elements and I/O are required to validate complex hardware designs.

Unique Advantages

• High programmable capacity: 382,464 logic elements give designers substantial headroom to integrate multiple functions on a single device.
• Significant embedded memory: Approximately 28.3 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O availability: 440 I/O pins support dense system-level connectivity without sacrificing board routing flexibility.
• Compact system-level package: The 1156-ball FCBGA (35×35) surface-mount package balances high integration density with board-space efficiency.
• Commercial readiness: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial manufacturing environments.
• Manufacturer pedigree: Supplied by AMD, providing consistency in sourcing and part identity.

Why Choose XC6VHX380T-3FFG1155C?

The XC6VHX380T-3FFG1155C positions itself as a high-capacity FPGA option for designs that demand a large number of logic elements, substantial on-chip RAM, and a high I/O count in a compact FCBGA package. Its voltage and temperature specifications suit standard commercial systems where integration density and resource availability are priorities.

This device is appropriate for engineering teams building complex digital processing, networking, data acquisition, or prototyping platforms that benefit from consolidated programmable resources and the procurement consistency of a known manufacturer.

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