XC6VLX130T-1FF1156C

The XC6VLX130T-1FF1156C is a Virtex‑6 LXT field programmable gate array (FPGA) from AMD, delivered in a 1156‑ball FCBGA package. It provides a high count of programmable logic resources, abundant on‑chip memory, and extensive I/O density for complex digital designs.

With 128,000 logic elements and approximately 9.73 Mbits of embedded memory, this commercial‑grade FPGA is suited to designs that require large-scale logic integration, substantial on‑chip buffering, and a high number of I/O connections while operating within a standard commercial temperature range.

Key Features

• Logic Capacity — 128,000 logic elements arranged across 10,000 CLBs to implement complex custom digital functions and state machines.
• Embedded Memory — Approximately 9.73 Mbits of on‑chip RAM to support data buffering, FIFOs, and local storage for high‑density designs.
• I/O Density — 600 programmable I/O pins for interfacing with multiple peripherals, buses, and external devices.
• Power Supply — Core voltage supply range of 0.95 V to 1.05 V to match system power domains and regulator designs.
• Package & Mounting — 1156‑ball FCBGA (1156‑BBGA) package, supplier device package 1156‑FCBGA (35×35), designed for surface mount assembly.
• Operating Conditions — Commercial grade device rated for operation from 0 °C to 85 °C, suitable for standard commercial applications.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• High‑density digital systems — Implement large custom logic blocks and complex control functions using the device’s 128,000 logic elements.
• Data buffering and packet handling — Utilize approximately 9.73 Mbits of embedded memory for on‑chip FIFOs, frame buffering, and temporary storage.
• Flexible I/O subsystems — Leverage 600 I/Os to connect to multiple buses, sensors, or peripheral interfaces in communication and processing systems.
• Prototyping and development platforms — Use the device’s high logic and memory capacity to validate complex architectures prior to production.

Unique Advantages

• Large logic fabric: 128,000 logic elements enable substantial on‑chip integration and consolidation of multiple functions into a single device.
• Significant embedded memory: Approximately 9.73 Mbits of RAM reduces external memory requirements and simplifies board‑level design.
• High I/O count: 600 I/Os provide design flexibility for dense connectivity and multi‑lane interfaces.
• Compact surface‑mount package: 1156‑ball FCBGA (35×35) delivers a high pin count in a single package suitable for modern PCB layouts.
• Commercial thermal range: Rated 0 °C to 85 °C for use in standard commercial environments.
• RoHS compliant: Conforms to lead‑free and hazardous substance requirements for environmentally conscious designs.

Why Choose XC6VLX130T-1FF1156C?

The XC6VLX130T-1FF1156C positions itself as a high‑capacity Virtex‑6 LXT FPGA option for engineers needing extensive programmable logic, substantial on‑chip memory, and a large number of I/Os in a single, surface‑mount FCBGA package. Its specifications make it appropriate for complex digital designs that benefit from consolidating logic and buffering on the FPGA.

Manufactured by AMD and offered in a 1156‑ball FCBGA package with RoHS compliance, this device suits teams and projects aiming to balance integration density with standard commercial operating conditions.

Request a quote or submit a pricing and availability request to get lead‑time and purchasing details for the XC6VLX130T-1FF1156C.