XC6VLX130T-1FFG1156I

The XC6VLX130T-1FFG1156I is a Virtex®-6 LXT Field Programmable Gate Array (FPGA) from AMD, supplied in a 1156-FCBGA (35×35) package. The device provides a large logic capacity and a high I/O count while operating at a core voltage range near 1 V, and is specified for industrial temperature operation.

Its combination of 128,000 logic elements, embedded memory, and extensive I/O makes it suitable for industrial and high-density embedded designs that require programmable logic and significant on-chip resources.

Key Features

• Logic Capacity – 128,000 logic elements to implement complex digital designs and extensive programmable logic functions.
• Embedded Memory – Approximately 9.73 Mbits of on-chip RAM (9,732,096 bits) for buffering, storage, and fast local data access.
• High I/O Count – 600 I/O pins to support wide parallel interfaces, multi-channel data aggregation, and dense system interconnects.
• Package – 1156-BBGA / 1156-FCBGA (35×35) surface-mount package for compact system integration and high pin density.
• Power Supply – Core voltage support from 0.950 V to 1.05 V, enabling operation within a defined low-voltage core window.
• Industrial Temperature Range – Specified operation from −40 °C to 100 °C for use in industrial environments.
• Mounting and Compliance – Surface-mount device with RoHS compliance for environmental requirement alignment.

Typical Applications

• Industrial Control Systems – Implement complex control logic, protocol bridging, and real-time processing within industrial temperature constraints.
• High‑Density I/O Platforms – Aggregate and route large numbers of signals in communication, instrumentation, or test & measurement equipment.
• Embedded Processing Modules – Provide programmable acceleration, data buffering, and custom logic for embedded systems requiring significant on‑chip memory and logic.

Unique Advantages

• High Logic Density: 128,000 logic elements enable large-scale programmable designs without immediate need for external logic expansion.
• Substantial On‑Chip Memory: Approximately 9.73 Mbits of embedded RAM reduces reliance on external memory for many buffering and caching functions.
• Extensive Connectivity: 600 I/O pins provide flexibility to interface with multiple peripherals, sensors, and parallel data sources.
• Industrial Robustness: −40 °C to 100 °C operating range supports deployment in industrial environments.
• Compact, High‑Pin Package: 1156-FCBGA (35×35) offers a space-efficient form factor for dense system designs.
• RoHS Compliant: Meets environmental compliance requirements for lead-free manufacturing processes.

Why Choose XC6VLX130T-1FFG1156I?

The XC6VLX130T-1FFG1156I positions itself as a high-capacity Virtex®-6 LXT FPGA suitable for engineers needing a balance of large programmable logic resources, significant on-chip memory, and a very high I/O count in a compact FCBGA package. Its industrial temperature rating and RoHS compliance make it an appropriate choice for robust embedded and industrial applications.

This device is well suited to teams designing scalable, high-density programmable systems that require substantial local memory and connectivity while maintaining a compact board footprint and defined core-voltage operation.

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