XC6VLX130T-2FF784I

The XC6VLX130T-2FF784I is a Virtex-6 LXT Field Programmable Gate Array designed for high-density, industrial-grade programmable logic applications. It provides 128,000 logic elements and approximately 9.7 Mbits of embedded memory, combined with 400 I/O and a 784-FCBGA (29×29) package for dense system integration.

Engineered for designs that require substantial on-chip resources and a wide operating range, this device supports a core voltage supply from 950 mV to 1.05 V and an operating temperature range of -40 °C to 100 °C, making it suitable for demanding industrial environments.

Key Features

• Programmable Logic Density  128,000 logic elements (cells) for implementing complex digital functions and custom processing pipelines.
• Embedded Memory  Approximately 9.7 Mbits of on-chip RAM to support buffering, LUT-based storage, and data-path requirements.
• I/O Resources  400 I/O pins to enable broad interfacing options with external devices and high-pin-count system requirements.
• Power Supply  Core voltage range of 950 mV to 1.05 V to match system power architectures and ensure reliable core operation.
• Package and Mounting  784-BBGA / 784-FCBGA (29×29) ball-grid array package in a surface-mount form factor for high-density PCB layouts.
• Industrial Temperature Grade  Rated for operation from -40 °C to 100 °C to meet temperature demands of industrial applications.
• Regulatory Compliance  RoHS-compliant for environmental and assembly process considerations.

Typical Applications

• Industrial Control  Implement real-time control logic, deterministic processing, and sensor interfacing using abundant logic resources and industrial temperature rating.
• Communications Infrastructure  Use high I/O count and on-chip memory for packet processing, protocol handling, and custom I/O interfacing in network equipment.
• Test & Measurement  Build configurable data acquisition, preprocessing, and timing logic leveraging the device’s dense logic and embedded RAM.
• Acceleration and Custom Processing  Offload compute-intensive or latency-sensitive functions to programmable fabric supported by extensive logic and memory resources.

Unique Advantages

• High Logic Capacity: 128,000 logic elements enable implementation of large, complex designs without external logic expansion.
• Substantial On-Chip Memory: Approximately 9.7 Mbits of embedded RAM reduces reliance on external memory for buffering and data-paths.
• Extensive I/O Count: 400 I/O pins provide flexibility for multi-channel interfaces and dense system connectivity.
• Industrial Temperature Range: Operation from -40 °C to 100 °C supports deployment in harsh or temperature-variable environments.
• Compact BGA Package: 784-FCBGA (29×29) enables high-density PCB designs while maintaining surface-mount assembly compatibility.
• RoHS Compliant: Meets environmental and manufacturing process requirements for modern electronics production.

Why Choose XC6VLX130T-2FF784I?

The XC6VLX130T-2FF784I positions itself as a high-density, industrial-grade FPGA option for engineers who need substantial programmable logic, on-chip memory, and a high I/O count in a compact BGA package. Its specified voltage range and extended operating temperature make it suitable for demanding embedded and infrastructure designs that require reliable on-board programmable resources.

Designed for projects that require scalability and long-term availability of programmable logic, this device is appropriate for design teams building complex control, communications, or acceleration systems where integration, thermal robustness, and resource density are key considerations.

Request a quote or submit an inquiry to receive pricing and availability information for the XC6VLX130T-2FF784I and to discuss how it fits your next design.