XC6VLX130T-2FFG484I

The XC6VLX130T-2FFG484I is a Virtex®-6 LXT field programmable gate array (FPGA) manufactured by AMD. It delivers high logic density and on-chip memory in a compact 484-BBGA package for designs that require substantial programmable logic, embedded RAM, and a broad set of I/O.

Built for systems operating across a wide temperature range and a low-voltage core domain, this FPGA targets applications that need a combination of logic capacity, memory resources, and I/O connectivity while meeting industrial-grade environmental requirements.

Key Features

• Logic Capacity — 128,000 logic elements provide significant programmable logic resources for complex digital designs.
• Embedded Memory — Approximately 9.73 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic functions.
• I/O Count — 240 user I/O pins to accommodate multiple interfaces and peripheral connections.
• Core Power — Specified supply voltage range of 0.95 V to 1.05 V for the device core.
• Package — 484-BBGA package; supplier device package listed as 484-FBGA (23x23), enabling a compact surface-mount implementation.
• Operating Temperature — Rated for −40°C to 100°C, suitable for industrial temperature environments.
• Mounting & Grade — Surface mount device with industrial grade classification and RoHS compliance.

Typical Applications

• High-density digital systems — Designs that require up to 128,000 logic elements for complex control and processing functions.
• Memory-intensive logic — Implementations that need approximately 9.73 Mbits of embedded memory for buffering, look-up tables, or state machines.
• I/O-rich interfaces — Systems that demand up to 240 user I/Os to connect multiple peripherals, sensors, or communication interfaces.
• Industrial and extended-temperature equipment — Applications requiring operation across −40°C to 100°C and industrial-grade component classification.

Unique Advantages

• High logic density: 128,000 logic elements enable consolidation of complex functions into a single programmable device, reducing board-level component count.
• Significant on-chip memory: Approximately 9.73 Mbits of embedded RAM supports local data buffering and accelerates memory-bound operations.
• Broad I/O capability: 240 I/O pins provide flexibility to interface with multiple subsystems without external multiplexers.
• Industrial temperature rating: −40°C to 100°C operation supports deployment in harsher environments and industrial applications.
• Low-voltage core operation: 0.95 V to 1.05 V core supply range aligns with power-sensitive designs and modern power-rail architectures.
• Compact surface-mount package: 484-BBGA / 484-FBGA (23x23) packaging enables high-density assembly and system miniaturization.

Why Choose XC6VLX130T-2FFG484I?

This Virtex‑6 LXT FPGA balances high programmable logic capacity, substantial embedded memory, and a large I/O complement in a compact package rated for industrial use. Its combination of 128,000 logic elements, approximately 9.73 Mbits of on-chip RAM, and 240 I/Os makes it well suited for demanding digital systems that require integration of multiple functions into a single device.

Manufactured by AMD and offered in a surface-mount 484-BBGA package with an extended operating temperature range, the XC6VLX130T-2FFG484I is positioned for designs that prioritize performance, integration, and environmental robustness.

Request a quote or submit a purchasing inquiry today to evaluate the XC6VLX130T-2FFG484I for your next high-density FPGA design.