XC6VLX130T-3FFG784C

The XC6VLX130T-3FFG784C is a Virtex®-6 LXT field-programmable gate array (FPGA) IC from AMD built for designs that require large programmable logic capacity, substantial on-chip memory, and a high I/O count. Its combination of 128,000 logic elements, approximately 9.73 Mbits of embedded memory, and 240 I/O pins supports complex digital systems in commercial applications.

Designed as a surface-mount, 784-ball FCBGA device with a core voltage range of 0.95–1.05 V and a commercial operating temperature range of 0 °C to 85 °C, this device targets projects where integration density and I/O connectivity are primary requirements.

Key Features

• Core Logic Density  Provides 128,000 logic elements to implement large, custom digital designs and complex logic functions.
• Embedded Memory  Approximately 9.73 Mbits of on-chip RAM for buffering, frame storage, or intermediate data processing without external memory.
• I/O Resources  240 device I/O pins to support multiple parallel interfaces and high-pin-count connectivity.
• Power and Voltage  Core supply specified from 0.95 V to 1.05 V to match system power-rail planning for FPGA core domains.
• Package and Mounting  784-ball FCBGA package (784-FCBGA, 29×29) in a surface-mount form factor for high-density board integration.
• Operating Range  Commercial grade device rated for 0 °C to 85 °C operation.
• Compliance  RoHS-compliant device meeting current restricted-material requirements.

Typical Applications

• High-density programmable logic systems  Implement large custom logic blocks and control fabric where substantial logic elements are required.
• Memory-intensive processing  Use the approximately 9.73 Mbits of embedded RAM for on-chip buffering, data staging, or intermediate storage to reduce external memory needs.
• High I/O interface hubs  Leverage 240 I/O pins for designs that require multiple parallel interfaces or dense connector mappings.

Unique Advantages

• Large on-chip logic capacity: 128,000 logic elements enable consolidation of complex functions into a single device, simplifying system design.
• Substantial embedded memory: Approximately 9.73 Mbits of RAM reduces dependence on external memory components for many buffering and processing tasks.
• Broad I/O availability: 240 I/O pins accommodate extensive peripheral and interface requirements without external multiplexing.
• Compact, high-density packaging: 784-ball FCBGA (29×29) package allows high integration on densely routed PCBs.
• Commercial temperature range: Rated for 0 °C to 85 °C to match typical commercial deployment environments.
• RoHS compliance: Meets standard environmental material restrictions for streamlined procurement and manufacturing.

Why Choose XC6VLX130T-3FFG784C?

This Virtex®-6 LXT FPGA delivers a balance of large logic capacity, significant embedded memory, and extensive I/O in a single commercial‑grade FCBGA package. It is suited to teams and designs that prioritize integration density, on-chip data handling, and high I/O connectivity while adhering to commercial temperature and RoHS requirements.

For projects requiring scalable programmable logic resources and on-board memory to reduce external component count, the XC6VLX130T-3FFG784C offers a compact, high-capacity option with clear electrical and package specifications to support system-level planning.

Request a quote or submit an inquiry to obtain pricing and availability for the XC6VLX130T-3FFG784C and to discuss how it can fit your design requirements.