XC6VLX130T-L1FF1156I

The XC6VLX130T-L1FF1156I is a Virtex®-6 LXT field programmable gate array (FPGA) IC from AMD. It provides a high logic density FPGA fabric with substantial on-chip memory and a large I/O complement in a 1156-ball FCBGA surface-mount package.

This device is targeted at designs that require a combination of many logic elements, significant embedded memory capacity, and hundreds of I/O lines. Key attributes include approximately 128,000 logic elements, approximately 9.73 Mbits of embedded memory, 600 I/Os, industrial-grade temperature range, and RoHS compliance.

Key Features

• Core Logic  Approximately 128,000 logic elements for implementing complex programmable logic and custom digital functions.
• Embedded Memory  Approximately 9.73 Mbits of on-chip RAM to support data buffering, FIFOs, and memory-intensive logic.
• I/O Capacity  600 available I/O pins to support wide parallel interfaces and a variety of external peripherals.
• Power Supply  Supported core voltage range from 0.910 V to 0.970 V for core power domains and power planning.
• Package & Mounting  1156-BBGA (1156-FCBGA, 35×35) surface-mount package for compact board-level integration.
• Temperature & Grade  Industrial operating range from −40 °C to 100 °C, suitable for industrial-grade deployments.
• Environmental Compliance  RoHS-compliant construction to meet lead-free manufacturing requirements.

Typical Applications

• Complex programmable logic systems  Implement custom digital architectures that require high logic density and flexible routing.
• Memory-intensive embedded designs  Use the device’s on-chip RAM for buffering, packet processing, or local data storage within FPGA logic.
• High-density I/O interfaces  Support wide parallel buses, multi-channel sensor interfaces, or numerous control signals with 600 I/Os.
• Industrial control and automation  Leverage the industrial temperature range and robust package for factory and process control applications.

Unique Advantages

• High logic density: Approximately 128,000 logic elements enable implementation of large, integrated digital functions on a single device.
• Substantial embedded memory: Approximately 9.73 Mbits of on-chip RAM reduces the need for external memory in many designs.
• Extensive I/O count: 600 I/Os simplify integration with multiple peripherals and wide data buses without complex multiplexing.
• Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in industrial environments.
• Compact FCBGA package: 1156-ball FCBGA (35×35) balances board area efficiency with high pin count for dense system layouts.
• Regulatory compliance: RoHS compliance supports lead-free assembly and environmentally conscious manufacturing.

Why Choose XC6VLX130T-L1FF1156I?

The XC6VLX130T-L1FF1156I positions itself as a high-capacity, industrial-grade FPGA option that brings together large logic resources, meaningful embedded memory, and a high I/O count in a single, surface-mount FCBGA package. These attributes make it suitable for designs that consolidate multiple functions into one programmable device while maintaining board-level compactness.

Choosing this FPGA is appropriate for engineering teams building dense, memory-aware programmable logic solutions that require industrial temperature operation and RoHS-compliant components. The combination of logic, memory, and I/O provides scalability for complex designs and long-term deployment in industrial applications.

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