XC6VLX130T-L1FF784I

The XC6VLX130T-L1FF784I is a Virtex®-6 LXT field programmable gate array (FPGA) IC from AMD, supplied in a 784-ball FCBGA package. It provides high logic density and substantial on-chip memory for systems that require large programmable logic capacity and extensive I/O.

With industrial-grade temperature range and a low-voltage core supply window, this device targets designs that need robust operation across demanding thermal and power conditions while consolidating multiple functions into a single programmable device.

Key Features

• Core Logic — 128000 logic elements (cells) provide significant programmable logic capacity for complex digital functions and custom hardware acceleration.
• Embedded Memory — Approximately 9.73 Mbits of on-chip RAM to support buffering, FIFO structures, and memory-heavy logic implementations without external memory for many use cases.
• I/O Capacity — 400 user I/O pins that enable wide connectivity to peripherals, interfaces, and board-level signals.
• Power — Core voltage supply range of 910 mV to 970 mV to match system power-rail planning and enable low-voltage operation.
• Package and Mounting — 784-ball BGA (784-FCBGA, 29 × 29 mm) in a surface-mount package for high-density board integration.
• Operating Temperature — Industrial operating range from −40 °C to 100 °C for reliable operation across extended temperature environments.
• Compliance — RoHS compliant, supporting regulatory requirements for restricted substances.

Typical Applications

• High-density digital systems — Use the device where large amounts of programmable logic are required to implement complex state machines, datapaths, and custom accelerators.
• Memory-intensive processing — Leverage approximately 9.73 Mbits of embedded RAM for buffering, packet processing, and local data storage in hardware designs.
• I/O-rich interfaces — Deploy in systems that require many parallel or serial connections, using the 400 available I/O pins for board- and system-level interconnect.

Unique Advantages

• High logic density: 128000 logic elements reduce the need for multiple devices by consolidating complex logic into a single FPGA.
• Substantial on-chip memory: Approximately 9.73 Mbits of embedded RAM supports data buffering and local storage, simplifying external memory requirements.
• Extensive I/O: 400 I/O pins enable flexible interfacing to sensors, transceivers, and other digital subsystems without additional multiplexing hardware.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in extended-temperature and industrial environments.
• Compact, surface-mount package: 784-FCBGA (29 × 29 mm) provides a high-pin-count, board-friendly solution for space-constrained designs.
• RoHS compliant: Meets restricted substance requirements for environmentally responsible designs.

Why Choose XC6VLX130T-L1FF784I?

The XC6VLX130T-L1FF784I combines large programmable logic capacity, considerable embedded memory, and extensive I/O in a single industrial-grade FPGA package. Its specifications make it well suited for engineering teams designing complex digital systems that require integration of multiple functions, on-chip data storage, and robust operation across a wide temperature range.

Designed as part of the Virtex®-6 LXT family, this device offers a scalable option for projects that demand high integration and predictable electrical and thermal characteristics, enabling consolidation of system functions and streamlined board-level design.

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