XC6VLX195T-1FF1156I

The XC6VLX195T-1FF1156I is a Virtex‑6 LXT field programmable gate array (FPGA) manufactured by AMD. It delivers high logic density, substantial embedded memory, and a large I/O count in a 1156‑ball FCBGA package for surface‑mount applications.

This industrial‑grade device is intended for designs that require significant programmable logic resources and on‑chip memory while operating across a broad supply and temperature range.

Key Features

• Core & Logic 15,600 logic cells providing 199,680 logic elements suitable for implementing complex digital functions.
• Embedded Memory Approximately 12.68 Mbits of on‑chip RAM to support buffering, packet processing, and local storage needs.
• I/O Capacity Up to 600 general‑purpose I/O pins to support high‑pin‑count interfaces and multi‑channel connectivity.
• Power Core voltage supply range of 0.95 V to 1.05 V to match system power rails and enable controlled power budgeting.
• Package & Mounting 1156‑BBGA (1156‑FCBGA, 35×35) surface‑mount package for compact board designs and reliable solder‑joint connections.
• Temperature & Grade Industrial grade operation from −40 °C to 100 °C, suitable for demanding environmental conditions.
• Compliance RoHS compliant to meet environmental directives for lead‑free assembly.

Typical Applications

• Industrial Control and Automation — Use the device’s 199,680 logic elements and industrial temperature rating for real‑time control, sequencing, and interface aggregation in factory equipment.
• High‑Density Digital Processing — Implement complex state machines, parallel processing pipelines, and custom logic functions leveraging the large logic and memory resources.
• I/O‑Intensive Systems — Support multi‑channel data acquisition, aggregation, or protocol bridging with up to 600 available I/O pins.

Unique Advantages

• High Logic Capacity: 199,680 logic elements enable large, integrated digital designs that reduce the need for multiple devices.
• Significant On‑Chip Memory: Approximately 12.68 Mbits of embedded RAM reduces external memory dependence and improves latency for buffering and local storage.
• Large I/O Count: 600 I/Os support dense connectivity for multi‑lane interfaces, sensors, and peripherals without external multiplexing.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for deployment in environments with wide temperature variation.
• Compact FCBGA Package: 1156‑FCBGA (35×35) surface‑mount package balances density and thermal/mechanical considerations for system integration.
• RoHS Compliant: Supports lead‑free assembly requirements for regulatory and supply‑chain compliance.

Why Choose XC6VLX195T-1FF1156I?

The XC6VLX195T-1FF1156I positions itself for designs that demand substantial programmable logic, embedded memory, and a high I/O count within an industrial temperature and surface‑mount package. Its combination of 199,680 logic elements, approximately 12.68 Mbits of on‑chip RAM, and 600 I/Os offers a compact, integrated building block for complex digital systems.

This device is suitable for engineering teams targeting durable, high‑density FPGA implementations where board footprint, thermal considerations, and environmental robustness are primary concerns.

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