XC6VLX195T-1FFG1156C
| Part Description |
Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 600 12681216 199680 1156-BBGA, FCBGA |
|---|---|
| Quantity | 1,245 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1156-FCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA, FCBGA | Number of I/O | 600 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 15600 | Number of Logic Elements/Cells | 199680 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12681216 |
Overview of XC6VLX195T-1FFG1156C – Virtex®-6 LXT Field Programmable Gate Array (FPGA)
The XC6VLX195T-1FFG1156C is a Virtex®-6 LXT Field Programmable Gate Array (FPGA) in a 1156-ball FCBGA package intended for commercial applications. It delivers high logic density and on-chip memory in a surface-mount 1156-FCBGA (35×35) package, with a supply voltage range of 0.95 V to 1.05 V and an operating temperature range of 0 °C to 85 °C.
With 199,680 logic elements, approximately 12.68 Mbits of embedded memory, and 600 I/Os, this device is targeted at designs that require significant programmable logic capacity and abundant I/O connectivity while maintaining RoHS-compliant manufacturing.
Key Features
- Logic Capacity Offers 199,680 logic elements and approximately 15,600 logic blocks to enable complex, high-density logic implementations.
- Embedded Memory Approximately 12.68 Mbits of on-chip RAM to support buffering, data storage, and state machines without external memory.
- I/O Resources 600 general-purpose I/O pins provide extensive connectivity for multi-channel interfaces and parallel/serial I/O requirements.
- Package and Mounting 1156-ball FCBGA package (1156-FCBGA, 35×35) designed for surface-mount assembly to support compact PCB layouts.
- Power Core supply range from 0.95 V to 1.05 V to match system power-rail specifications.
- Operating Range Commercial-grade device rated for 0 °C to 85 °C operation and compliant with RoHS environmental requirements.
Typical Applications
- High-density digital processing Large-scale programmable logic implementations that leverage 199,680 logic elements for complex algorithms and parallel processing.
- I/O-intensive systems Systems requiring broad external device connectivity can utilize the 600 I/Os for multi-channel interfaces, data aggregation, and control buses.
- Embedded buffering and control On-chip memory of approximately 12.68 Mbits supports local buffering, packet handling, and state retention without immediate external memory needs.
Unique Advantages
- High logic density: 199,680 logic elements enable implementation of large-scale designs on a single FPGA, reducing the need for multiple devices.
- Significant embedded memory: Approximately 12.68 Mbits of on-chip RAM lowers external memory dependency and simplifies board-level design.
- Extensive I/O count: 600 I/Os provide flexibility for diverse interface requirements and parallel connectivity options.
- Compact FCBGA package: 1156-ball FCBGA (35×35) supports high-density PCB layouts while keeping the device surface-mount compatible.
- Commercial temperature rating: Rated for 0 °C to 85 °C operation, appropriate for general-purpose commercial applications.
- RoHS compliant: Meets RoHS environmental requirements for lead-free manufacturing and assembly.
Why Choose XC6VLX195T-1FFG1156C?
The XC6VLX195T-1FFG1156C positions itself as a high-capacity, I/O-rich Virtex®-6 LXT FPGA suitable for commercial designs requiring substantial programmable logic and embedded memory in a single surface-mount package. Its combination of nearly 200k logic elements, approximately 12.68 Mbits of on-chip RAM, and 600 I/Os provides designers with the resources to consolidate functions, reduce board complexity, and support dense system-level integration.
This device is well suited for development teams and OEMs focused on scalability and integration where commercial temperature operation, RoHS compliance, and a compact 1156-FCBGA footprint are important. Its specification set supports long-term design planning within the constraints of the documented voltage and temperature ranges.
Request a quote or submit a purchase inquiry to obtain pricing and availability for the XC6VLX195T-1FFG1156C.

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