XC6VLX195T-1FFG1156C

IC FPGA 600 I/O 1156FCBGA
Part Description

Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 600 12681216 199680 1156-BBGA, FCBGA

Quantity 1,245 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1156-FCBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1156-BBGA, FCBGANumber of I/O600Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs15600Number of Logic Elements/Cells199680
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12681216

Overview of XC6VLX195T-1FFG1156C – Virtex®-6 LXT Field Programmable Gate Array (FPGA)

The XC6VLX195T-1FFG1156C is a Virtex®-6 LXT Field Programmable Gate Array (FPGA) in a 1156-ball FCBGA package intended for commercial applications. It delivers high logic density and on-chip memory in a surface-mount 1156-FCBGA (35×35) package, with a supply voltage range of 0.95 V to 1.05 V and an operating temperature range of 0 °C to 85 °C.

With 199,680 logic elements, approximately 12.68 Mbits of embedded memory, and 600 I/Os, this device is targeted at designs that require significant programmable logic capacity and abundant I/O connectivity while maintaining RoHS-compliant manufacturing.

Key Features

  • Logic Capacity  Offers 199,680 logic elements and approximately 15,600 logic blocks to enable complex, high-density logic implementations.
  • Embedded Memory  Approximately 12.68 Mbits of on-chip RAM to support buffering, data storage, and state machines without external memory.
  • I/O Resources  600 general-purpose I/O pins provide extensive connectivity for multi-channel interfaces and parallel/serial I/O requirements.
  • Package and Mounting  1156-ball FCBGA package (1156-FCBGA, 35×35) designed for surface-mount assembly to support compact PCB layouts.
  • Power  Core supply range from 0.95 V to 1.05 V to match system power-rail specifications.
  • Operating Range  Commercial-grade device rated for 0 °C to 85 °C operation and compliant with RoHS environmental requirements.

Typical Applications

  • High-density digital processing  Large-scale programmable logic implementations that leverage 199,680 logic elements for complex algorithms and parallel processing.
  • I/O-intensive systems  Systems requiring broad external device connectivity can utilize the 600 I/Os for multi-channel interfaces, data aggregation, and control buses.
  • Embedded buffering and control  On-chip memory of approximately 12.68 Mbits supports local buffering, packet handling, and state retention without immediate external memory needs.

Unique Advantages

  • High logic density: 199,680 logic elements enable implementation of large-scale designs on a single FPGA, reducing the need for multiple devices.
  • Significant embedded memory: Approximately 12.68 Mbits of on-chip RAM lowers external memory dependency and simplifies board-level design.
  • Extensive I/O count: 600 I/Os provide flexibility for diverse interface requirements and parallel connectivity options.
  • Compact FCBGA package: 1156-ball FCBGA (35×35) supports high-density PCB layouts while keeping the device surface-mount compatible.
  • Commercial temperature rating: Rated for 0 °C to 85 °C operation, appropriate for general-purpose commercial applications.
  • RoHS compliant: Meets RoHS environmental requirements for lead-free manufacturing and assembly.

Why Choose XC6VLX195T-1FFG1156C?

The XC6VLX195T-1FFG1156C positions itself as a high-capacity, I/O-rich Virtex®-6 LXT FPGA suitable for commercial designs requiring substantial programmable logic and embedded memory in a single surface-mount package. Its combination of nearly 200k logic elements, approximately 12.68 Mbits of on-chip RAM, and 600 I/Os provides designers with the resources to consolidate functions, reduce board complexity, and support dense system-level integration.

This device is well suited for development teams and OEMs focused on scalability and integration where commercial temperature operation, RoHS compliance, and a compact 1156-FCBGA footprint are important. Its specification set supports long-term design planning within the constraints of the documented voltage and temperature ranges.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the XC6VLX195T-1FFG1156C.

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