XC6VLX195T-2FF1156C

The XC6VLX195T-2FF1156C is a Virtex®-6 LXT field programmable gate array (FPGA) in a 1156-ball FCBGA package. It provides large programmable logic capacity and extensive I/O counts for complex digital designs. This device is aimed at applications that require significant on-chip logic, embedded memory, and a high number of I/O signals within a compact, surface-mount package.

Key Features

• Programmable Logic Capacity  199,680 logic elements to implement complex custom logic, state machines, and datapaths.
• Embedded Memory  Approximately 12.68 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O Resources  600 user I/O pins to support wide parallel interfaces, multi-channel connectivity, or dense peripheral integration.
• Power Supply Range  Core voltage supply range from 0.95 V to 1.05 V, enabling defined operating conditions for core logic.
• Package and Mounting  1156-FCBGA (35×35) package in a surface-mount form factor for high-density PCB integration.
• Operating Grade and Temperature  Commercial grade device rated for 0 °C to 85 °C operation.
• Standards Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Implement large custom logic blocks and accelerate data-paths using the device’s 199,680 logic elements and on-chip RAM.
• Multi-interface systems  Integrate wide parallel buses and multiple peripherals leveraging up to 600 I/O pins in a single FPGA package.
• Embedded buffering and packet processing  Use the approximately 12.68 Mbits of embedded RAM for packet queues, FIFOs, and temporary storage in streaming applications.

Unique Advantages

• Large logic fabric: 199,680 logic elements provide the capacity to consolidate multiple functions into one programmable device, reducing board-level component count.
• Substantial on-chip memory: Approximately 12.68 Mbits of embedded RAM supports local storage needs, lowering external memory dependence and simplifying system design.
• High I/O density: 600 I/O pins enable extensive connectivity and flexible interface options without external multiplexing.
• Compact, manufacturable package: 1156-FCBGA (35×35) surface-mount package balances high pin count with a footprint suitable for dense PCBs.
• Defined operating window: Commercial temperature range (0 °C to 85 °C) and specified core voltage range (0.95–1.05 V) help streamline power and thermal planning.
• RoHS compliant: Meets common environmental regulatory requirements for assembly.

Why Choose XC6VLX195T-2FF1156C?

The XC6VLX195T-2FF1156C positions itself as a high-capacity, configurable platform for designs that require substantial logic resources, significant on-chip memory, and a large number of I/O signals in a compact FCBGA package. Its combination of nearly 200k logic elements, approximately 12.68 Mbits of embedded RAM, and 600 I/Os makes it suitable for consolidating multiple functions onto a single FPGA to reduce BOM complexity and simplify board layouts.

This commercial-grade, RoHS-compliant device is appropriate for engineering teams building scalable, high-density programmable solutions who need clearly specified electrical and thermal operating parameters to plan power delivery and thermal management.

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