XC6VLX195T-2FF1156I

The XC6VLX195T-2FF1156I is a Virtex®-6 LXT field programmable gate array (FPGA) from AMD, provided in a 1156-ball FCBGA package. It delivers high logic density and on-chip memory with a large I/O count and industrial temperature grading for deployment in demanding systems.

Key on-chip resources include 15,600 CLBs and 199,680 logic elements, approximately 12.68 Mbits of embedded memory, and 600 user I/Os, with a core supply range of 0.95–1.05 V and an operating temperature range of –40 °C to 100 °C.

Key Features

• Logic Fabric  15,600 CLBs (configurable logic blocks) providing 199,680 logic elements for implementing complex digital functions.
• Embedded Memory  Approximately 12.68 Mbits (12,681,216 bits) of on-chip RAM to support data buffering, state storage, and intermediate processing.
• I/O Capacity  600 user input/output pins to accommodate wide parallel interfaces and numerous external peripherals.
• Power  Core voltage supply range of 0.95–1.05 V to match system power-rail requirements and design constraints.
• Package & Mounting  1156-ball FCBGA package (1156-FCBGA, 35 × 35) in a surface-mount form factor for compact PCB integration.
• Industrial Grade & Temperature  Rated industrial grade with an operating temperature range of –40 °C to 100 °C for use in harsher environments.
• Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-density programmable logic systems  Leverage 199,680 logic elements and approximately 12.68 Mbits of embedded memory for complex, customizable digital functions.
• I/O-intensive designs  Use the 600 available I/Os to support designs that require many external connections or parallel interfaces.
• Industrial equipment  Industrial grade construction and a –40 °C to 100 °C operating range support deployment in industrial environments.

Unique Advantages

• High logic density: 199,680 logic elements enable integration of substantial digital functionality on a single device, reducing system complexity.
• Significant on-chip memory: Approximately 12.68 Mbits of embedded RAM reduces dependence on external memory for buffering and intermediate storage.
• Large I/O count: 600 user I/Os provide flexibility for multi-channel interfaces and parallel signal handling without external I/O expanders.
• Industrial temperature capability: –40 °C to 100 °C operation supports use in temperature-challenging installations.
• Compact surface-mount package: 1156-ball FCBGA (35 × 35) package enables dense PCB placements while maintaining robust interconnects.
• Regulatory readiness: RoHS compliance simplifies regulatory and manufacturing requirements for environmentally conscious designs.

Why Choose XC6VLX195T-2FF1156I?

The XC6VLX195T-2FF1156I combines substantial logic resources, ample embedded memory, and a high I/O count in a compact 1156-ball FCBGA surface-mount package. Its industrial-grade temperature range and RoHS compliance make it a suitable choice for projects requiring durable hardware resources and environmental compliance.

This device is well suited to designers who need significant on-chip capacity and connectivity for dense programmable logic implementations, and who require components capable of operating across a wide temperature range.

Request a quote to discuss pricing and availability for the XC6VLX195T-2FF1156I or to obtain additional ordering information.