XC6VLX195T-2FFG784I

The XC6VLX195T-2FFG784I is a Virtex®-6 LXT FPGA IC from AMD designed for demanding industrial applications. It integrates a large programmable fabric with substantial on-chip memory and extensive I/O to support complex digital logic, control, and interfacing tasks.

With 199,680 logic elements, approximately 12.68 Mbits of embedded memory and 400 I/Os, this surface-mount 784-FCBGA (29×29) device delivers high integration and flexibility for systems requiring significant logic capacity and I/O density. It operates from 0.95 V to 1.05 V and is specified for an operating range of −40 °C to 100 °C.

Key Features

• Logic Capacity 199,680 logic elements provide substantial programmable fabric for implementing large-scale digital designs and complex algorithms.
• Embedded Memory Approximately 12.68 Mbits of on-chip RAM to store buffers, state machines, and data structures without external memory in many use cases.
• I/O Count 400 general-purpose I/Os to support wide-ranging peripheral connectivity and parallel interfaces.
• Power Supply Core supply range of 0.95 V to 1.05 V to match system power architectures and ensure predictable core operation.
• Package and Mounting 784‑ball FCBGA (29×29) surface-mount package (784‑BBGA, FCBGA) for compact board-level integration.
• Industrial Temperature Range Rated for −40 °C to 100 °C to meet ambient conditions typical of industrial deployments.
• Regulatory Compliance RoHS compliant for lead-free manufacturing and environmental requirements.

Typical Applications

• Industrial Control Systems Use the FPGA’s large logic capacity and broad I/O to implement customizable control algorithms, sequencing, and sensor/actuator interfaces.
• High-Density I/O Interfaces Leverage 400 I/Os to aggregate and translate multiple parallel interfaces or to provide extensive peripheral connectivity on a single device.
• Data Buffering and Processing On-chip memory enables buffering, packet handling, and intermediate data processing without relying solely on external memories.

Unique Advantages

• High Integration: Combines nearly 200k logic elements with significant on-chip RAM to reduce external component count and simplify board design.
• I/O-Rich Platform: 400 I/Os allow direct interfacing to many peripherals and parallel buses, minimizing the need for additional I/O expansion.
• Industrial Reliability: Specified operation from −40 °C to 100 °C and RoHS compliance support deployment in industrial environments with environmental constraints.
• Compact Package: 784‑FBGGA (29×29) surface-mount packaging enables high-density PCB layouts while providing the required ball count for extensive signals.
• Predictable Power Envelope: Clear core voltage range (0.95 V–1.05 V) simplifies power-supply design and system integration.

Why Choose XC6VLX195T-2FFG784I?

The XC6VLX195T-2FFG784I positions itself as a highly integrated FPGA solution for industrial designs that need large logic capacity, ample embedded memory, and broad I/O connectivity in a compact FCBGA package. Its specified temperature range and RoHS compliance make it suitable for long-term deployment in environments that demand reliability and regulatory alignment.

This device is well suited to engineering teams developing complex control, data processing, or multi-interface systems that benefit from consolidating functions into a single programmable device, enabling scalable designs and reducing overall bill-of-materials complexity.

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