XC6VLX195T-2FFG784C

The XC6VLX195T-2FFG784C is a Virtex®-6 LXT family Field Programmable Gate Array (FPGA) from AMD, supplied in a 784-ball FCBGA package. It delivers a large on-chip logic fabric and embedded memory tailored for designs that require substantial logic density and I/O capacity within a commercial temperature range.

Key device attributes include 199,680 logic elements, approximately 12.68 Mbits of embedded memory, and 400 I/O pins, making it suitable for complex, reconfigurable digital designs where integration and I/O density matter.

Key Features

• Core Logic 15,600 CLBs and 199,680 logic elements provide extensive capacity for implementing custom digital logic and parallel processing architectures.
• Embedded Memory Approximately 12.68 Mbits of on-chip RAM for buffering, lookup tables, and state storage to support memory-intensive designs.
• I/O and Packaging 400 available I/O pins in a 784-FCBGA (29×29) package, enabling high-density external connectivity in a surface-mount form factor.
• Power Supply Operates from a core voltage supply range of 0.95 V to 1.05 V, allowing designers to plan power delivery and sequencing precisely.
• Operating Range Commercial-grade operating temperature from 0 °C to 85 °C and RoHS compliance for regulatory and assembly considerations.
• Mounting and Package Case Surface-mount device in a 784-BBGA / FCBGA package case, supplier device package listed as 784-FCBGA (29×29).

Typical Applications

• Reconfigurable digital processing Implements custom datapaths and control logic using the device's 199,680 logic elements and embedded memory for buffering and local storage.
• High-density I/O systems Leverages 400 I/O pins and a compact 784-FCBGA package to interface with multiple peripherals and external devices.
• Memory-centric FPGA functions Uses approximately 12.68 Mbits of on-chip RAM for packet buffering, lookup tables, or other embedded storage needs.

Unique Advantages

• Large logic capacity: 199,680 logic elements enable implementation of extensive custom logic and parallel processing within a single device, reducing the need for multiple FPGAs.
• Substantial embedded memory: Approximately 12.68 Mbits of on-chip RAM supports memory-intensive operations without immediately relying on external memory.
• High I/O density: 400 I/Os provide flexible connectivity options for complex board-level interfaces and multi-channel systems.
• Compact, manufacturable package: 784-FCBGA (29×29) surface-mount package balances I/O count and board-area considerations for production designs.
• Defined commercial operating range: Rated for 0 °C to 85 °C operation, suitable for standard commercial applications and environments.
• Regulatory compliance: RoHS-compliant construction facilitates integration into lead-free assembly processes.

Why Choose XC6VLX195T-2FFG784C?

The XC6VLX195T-2FFG784C positions itself as a high-capacity Virtex®-6 LXT FPGA option for teams needing significant on-chip logic, embedded memory, and I/O in a single commercial-grade device. Its combination of 199,680 logic elements, approximately 12.68 Mbits of RAM, and 400 I/Os in a 784-FCBGA package makes it well suited to complex, reconfigurable designs where integration and I/O density reduce board-level component count.

Manufactured by AMD and provided in a surface-mount FCBGA package, this part offers a balance of logic density, memory, and connectivity for engineering teams focused on scalable FPGA-based systems within commercial temperature environments.

Request a quote or submit a pricing inquiry to obtain availability, lead times, and volume pricing for the XC6VLX195T-2FFG784C. Our team can provide a formal quote to support your procurement and design planning.