XC6VLX195T-2FFG1156C

The XC6VLX195T-2FFG1156C is a Virtex®-6 LXT field programmable gate array (FPGA) in a 1156-ball FCBGA package intended for commercial applications. It combines high logic capacity, substantial on-chip memory, and a large I/O count to support complex digital designs and system-level integration.

This device targets designers who require dense programmable logic, embedded RAM, and broad external interfacing within a surface-mount FCBGA package, while operating within a commercial temperature range.

Key Features

• Core Logic  Approximately 199,680 logic elements (cells) to implement complex digital functions and custom hardware accelerators.
• Embedded Memory  Approximately 12.68 Mbits of on-chip RAM (12,681,216 bits) for buffering, FIFOs, and local data storage.
• I/O Capacity  600 user I/Os to support wide parallel interfaces, multi-channel connectivity, and high-pin-count system designs.
• Package & Mounting  1156-ball FCBGA (1156-FCBGA, 35×35) package in a surface-mount form factor for compact board-level integration.
• Supply Voltage  Core voltage range of 0.950 V to 1.05 V to match system power rails and design constraints.
• Operating Conditions  Commercial grade operation from 0 °C to 85 °C, suitable for standard commercial electronics environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Communications Equipment  Implements packet processing, protocol bridging, and custom interface logic with large logic and I/O capacity.
• Video and Imaging Systems  Supports video pre-processing, frame buffering, and parallel data paths using on-chip RAM and abundant I/O.
• High-Performance Data Processing  Enables hardware acceleration and custom DSP pipelines requiring significant logic resources and memory.
• Test & Measurement Hardware  Provides flexible signal conditioning, capture, and control logic for instrumentation platforms.

Unique Advantages

• High Logic Density: Nearly 200k logic elements allow consolidation of multiple functions into a single FPGA, reducing system BOM.
• Substantial On-Chip RAM: Approximately 12.68 Mbits of embedded memory supports large buffers, FIFOs, and local data storage without external RAM.
• Extensive I/O Count: 600 I/Os facilitate high-bandwidth external interfacing and flexible connectivity options.
• Compact Ball-Grid Package: 1156-FCBGA (35×35) enables dense board layouts and surface-mount assembly for space-constrained systems.
• Commercial Temperature Rating: Rated 0 °C to 85 °C to match typical commercial product deployment environments.
• RoHS Compliant: Meets common environmental requirements for lead-free assembly.

Why Choose XC6VLX195T-2FFG1156C?

The XC6VLX195T-2FFG1156C positions itself as a high-capacity, commercially rated FPGA option for designers needing significant programmable logic, abundant embedded memory, and a large number of I/Os in a compact FCBGA package. Its specification set supports consolidation of complex digital functions and high-throughput interfacing in commercial systems.

Backed by the Virtex®-6 family heritage from AMD, this device is suited to teams developing communications, imaging, data processing, and instrumentation products that require dense logic, on-chip RAM, and flexible board-level integration.

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