XC6VLX195T-2FFG1156I

The XC6VLX195T-2FFG1156I is a Virtex‑6 LXT field programmable gate array (FPGA) provided in a 1156‑ball FCBGA package. It delivers high logic capacity with approximately 199,680 logic elements and approximately 12.68 Mbits of embedded RAM, combined with 600 user I/O pins for complex system interfacing.

Designed for industrial-grade environments, the device supports a nominal core voltage range of 0.95 V to 1.05 V and an operating temperature range from -40 °C to 100 °C, making it suitable for demanding embedded designs that require large FPGA fabric and significant on‑chip memory.

Key Features

• Core Capacity  Approximately 199,680 logic elements provide extensive programmable resources for large-scale digital designs.
• Embedded Memory  Approximately 12.68 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage without external memory.
• I/O  600 user I/O pins enable wide parallel interfacing and flexible connectivity options to external peripherals and subsystems.
• Package & Mounting  1156‑ball FCBGA package (35 × 35 mm) designed for surface-mount assembly to support dense board layouts.
• Power Supply  Core voltage specified between 0.95 V and 1.05 V to match system power delivery and thermal planning.
• Environmental & Grade  Industrial grade device with an operating temperature range of -40 °C to 100 °C; RoHS compliant.

Typical Applications

• High‑throughput signal processing  Large logic capacity and substantial embedded RAM support complex filtering, FFTs, and pipeline designs that require on‑chip data storage.
• Communications infrastructure  Extensive I/O and programmable fabric enable implementation of protocol engines, packet processing, and interface bridging in network equipment.
• Imaging and video processing  On‑chip memory combined with high logic density supports frame buffering, image pipelines, and real‑time video algorithms.

Unique Advantages

• High logic density: Approximately 199,680 logic elements allow integration of large custom logic blocks and complex state machines on a single device, reducing board-level component count.
• Significant embedded memory: Approximately 12.68 Mbits of on‑chip RAM minimizes dependence on external memory for many buffering and caching tasks, simplifying system design.
• Broad I/O capability: 600 user I/O pins provide the headroom needed for wide data buses, parallel interfaces, and multi‑lane connectivity without external multiplexing.
• Industrial temperature range: Rated for -40 °C to 100 °C operation, enabling deployment in environments with extended temperature requirements.
• Compact, surface‑mount package: The 1156‑ball FCBGA (35 × 35 mm) offers a compact footprint for high-density PCB layouts while supporting the device’s I/O count and power needs.

Why Choose XC6VLX195T-2FFG1156I?

The XC6VLX195T-2FFG1156I balances large programmable fabric, substantial on‑chip memory, and a high I/O count within an industrial‑grade FPGA package. This combination makes it well suited for engineers building designs that require extensive logic integration, local data storage, and robust I/O connectivity in temperature‑sensitive applications.

Its specification-driven attributes — logic capacity, embedded RAM, I/O density, package type, supply voltage range, and RoHS compliance — offer a clear platform for scalable, long‑lived designs where integration and reliability are priorities.

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