XC6VLX195T-1FFG784I

IC FPGA 400 I/O 784FCBGA
Part Description

Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 400 12681216 199680 784-BBGA, FCBGA

Quantity 1,119 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package784-FCBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case784-BBGA, FCBGANumber of I/O400Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs15600Number of Logic Elements/Cells199680
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12681216

Overview of XC6VLX195T-1FFG784I – Virtex®-6 LXT FPGA, 199,680 Logic Elements, 784-FCBGA

The XC6VLX195T-1FFG784I is a Virtex®-6 LXT field programmable gate array (FPGA) provided in a 784-ball FCBGA package. It delivers large programmable logic capacity and on-chip memory for complex, high-density digital designs.

Designed for industrial-grade deployments, this device features a broad operating temperature range and a compact 29×29 784-FCBGA package, making it suitable for space-constrained systems that require substantial logic, I/O, and embedded RAM.

Key Features

  • Logic Capacity  15,600 CLBs and 199,680 logic elements enable implementation of large-scale programmable logic designs.
  • Embedded Memory  Approximately 12.68 Mbits of on-chip RAM to support data buffering, FIFOs, and intermediate storage without external memory.
  • I/O Density  400 user I/O pins provide flexible connectivity for interfaces and peripherals.
  • Core Supply  Core voltage range of 0.95 V to 1.05 V for the device’s internal power domain.
  • Package & Mounting  784-FCBGA (29×29) package in a surface-mount format for high-density board designs.
  • Temperature & Grade  Industrial-grade device rated for operation from −40°C to 100°C to meet demanding environmental requirements.
  • RoHS Compliance  Manufactured in accordance with RoHS requirements.

Unique Advantages

  • High programmable logic capacity: 199,680 logic elements and 15,600 CLBs allow complex logic assemblies and parallel processing architectures within a single device.
  • Substantial on-chip RAM: Approximately 12.68 Mbits of embedded memory reduces dependence on external RAM for many buffering and storage needs.
  • Extensive I/O: 400 user I/Os provide flexible interfacing for multiple peripherals and mezzanine connections.
  • Industrial temperature rating: −40°C to 100°C operation supports reliable use in industrial environments.
  • Compact FCBGA package: 784-ball, 29×29 FCBGA package enables high-density PCB implementations with surface-mount mounting.
  • RoHS compliant: Aligns with lead-free manufacturing and environmental restrictions.

Why Choose XC6VLX195T-1FFG784I?

The XC6VLX195T-1FFG784I positions itself as a high-capacity, industrial-grade FPGA option within the Virtex-6 LXT family, combining substantial logic resources, embedded RAM, and a large I/O complement in a compact 784-FCBGA package. Its specified core voltage range and extended operating temperature make it suitable for designs that require robust, long-term operation in challenging environments.

This device is well suited to development teams and procurement groups seeking a single-FPGA solution that consolidates logic, memory, and I/O density to reduce board-level complexity while meeting industrial temperature and RoHS requirements.

Request a quote or submit an inquiry to obtain pricing and availability for the XC6VLX195T-1FFG784I and discuss fit for your design requirements.

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