XC6VLX195T-1FFG784I
| Part Description |
Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 400 12681216 199680 784-BBGA, FCBGA |
|---|---|
| Quantity | 1,119 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 784-FCBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 784-BBGA, FCBGA | Number of I/O | 400 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 15600 | Number of Logic Elements/Cells | 199680 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12681216 |
Overview of XC6VLX195T-1FFG784I – Virtex®-6 LXT FPGA, 199,680 Logic Elements, 784-FCBGA
The XC6VLX195T-1FFG784I is a Virtex®-6 LXT field programmable gate array (FPGA) provided in a 784-ball FCBGA package. It delivers large programmable logic capacity and on-chip memory for complex, high-density digital designs.
Designed for industrial-grade deployments, this device features a broad operating temperature range and a compact 29×29 784-FCBGA package, making it suitable for space-constrained systems that require substantial logic, I/O, and embedded RAM.
Key Features
- Logic Capacity 15,600 CLBs and 199,680 logic elements enable implementation of large-scale programmable logic designs.
- Embedded Memory Approximately 12.68 Mbits of on-chip RAM to support data buffering, FIFOs, and intermediate storage without external memory.
- I/O Density 400 user I/O pins provide flexible connectivity for interfaces and peripherals.
- Core Supply Core voltage range of 0.95 V to 1.05 V for the device’s internal power domain.
- Package & Mounting 784-FCBGA (29×29) package in a surface-mount format for high-density board designs.
- Temperature & Grade Industrial-grade device rated for operation from −40°C to 100°C to meet demanding environmental requirements.
- RoHS Compliance Manufactured in accordance with RoHS requirements.
Unique Advantages
- High programmable logic capacity: 199,680 logic elements and 15,600 CLBs allow complex logic assemblies and parallel processing architectures within a single device.
- Substantial on-chip RAM: Approximately 12.68 Mbits of embedded memory reduces dependence on external RAM for many buffering and storage needs.
- Extensive I/O: 400 user I/Os provide flexible interfacing for multiple peripherals and mezzanine connections.
- Industrial temperature rating: −40°C to 100°C operation supports reliable use in industrial environments.
- Compact FCBGA package: 784-ball, 29×29 FCBGA package enables high-density PCB implementations with surface-mount mounting.
- RoHS compliant: Aligns with lead-free manufacturing and environmental restrictions.
Why Choose XC6VLX195T-1FFG784I?
The XC6VLX195T-1FFG784I positions itself as a high-capacity, industrial-grade FPGA option within the Virtex-6 LXT family, combining substantial logic resources, embedded RAM, and a large I/O complement in a compact 784-FCBGA package. Its specified core voltage range and extended operating temperature make it suitable for designs that require robust, long-term operation in challenging environments.
This device is well suited to development teams and procurement groups seeking a single-FPGA solution that consolidates logic, memory, and I/O density to reduce board-level complexity while meeting industrial temperature and RoHS requirements.
Request a quote or submit an inquiry to obtain pricing and availability for the XC6VLX195T-1FFG784I and discuss fit for your design requirements.

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