XC6VLX195T-1FFG784C

The XC6VLX195T-1FFG784C is a Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC from AMD provided in a 784-ball FCBGA (29×29) package. It delivers a high logic-capacity fabric combined with substantial on-chip RAM and a large I/O count for complex, integrated digital designs.

Designed for commercial-grade applications, this surface-mount FPGA supports supply voltages from 0.95 V to 1.05 V and an operating temperature range of 0 °C to 85 °C, making it suitable for a wide range of standard embedded and communication-focused systems.

Key Features

• Logic Capacity — 15,600 CLBs and 199,680 logic elements provide the resources needed to implement large, multi-function digital designs on a single device.
• Embedded Memory — Approximately 12.68 Mbits of on-chip RAM enables local data buffering, state storage, and algorithm acceleration without immediate reliance on external memory.
• I/O Count — 400 user I/O pins support extensive external interfacing for parallel buses, multiple peripherals, and diverse signal routing.
• Packaging & Mounting — 784-BBGA (784-FCBGA, 29×29) surface-mount package offers a high-density footprint for board-level integration.
• Power — Core supply range of 0.95 V to 1.05 V allows precise power budgeting for system design.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C for typical commercial deployments.
• Compliance — RoHS compliant for environmental and regulatory alignment in commercial products.

Typical Applications

• Communications Equipment — Implements complex protocol logic and wide parallel interfaces using high logic density and 400 I/Os to support multi-channel designs.
• Data Processing and Acceleration — Leverages 199,680 logic elements and on-chip RAM to accelerate custom processing tasks and reduce external memory traffic.
• Prototyping and System Development — Provides a large, flexible fabric for board-level prototyping and verification of high-density digital logic.
• Video and Imaging Systems — Uses abundant logic and embedded memory to handle buffer-intensive and parallel data paths common in imaging pipelines.

Unique Advantages

• High Integration Density: 15,600 CLBs and 199,680 logic elements enable consolidation of multiple functions into a single FPGA, reducing BOM complexity.
• Substantial On-Chip RAM: Approximately 12.68 Mbits of embedded memory helps keep frequently accessed data on-chip, improving latency and simplifying board-level memory design.
• Extensive External Connectivity: 400 I/Os support broad interfacing needs, from parallel buses to multiple peripheral channels, facilitating system-level integration.
• Board-Level Compatibility: 784-FCBGA (29×29) surface-mount packaging provides a compact, high-density solution for populated PCBs.
• Commercial Reliability: Commercial temperature rating and RoHS compliance support mainstream product development and regulatory needs.

Why Choose XC6VLX195T-1FFG784C?

The XC6VLX195T-1FFG784C positions itself as a high-capacity Virtex®-6 LXT FPGA offering substantial logic resources, on-chip RAM, and a large I/O complement in a compact 784-FCBGA package. It is well suited to designers who need to implement complex, memory-intensive logic and extensive external interfacing within commercial-temperature systems.

With clear supply voltage and temperature specifications and RoHS compliance, this FPGA provides predictable integration characteristics for long-term platform designs where logic density, embedded memory, and I/O scalability are primary considerations.

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