XC6VLX130T-L1FFG784I

The XC6VLX130T-L1FFG784I is a Virtex‑6 LXT class FPGA delivered in a 784‑ball FCBGA surface‑mount package. It provides a large logic fabric with extensive on‑chip memory and a high I/O count, designed for industrial applications requiring high integration and reliable operation across a broad temperature range.

This device targets designs that need substantial programmable logic capacity, significant embedded RAM, and numerous external interfaces while maintaining industrial temperature support and RoHS compliance.

Key Features

• Logic Capacity — 128,000 logic elements providing significant programmable logic resource for complex designs.
• Embedded Memory — Approximately 9.7 Mbits of on‑chip RAM to support buffering, state storage, and data processing functions.
• I/O Resources — 400 user I/O pins to accommodate dense external interfacing and multi‑lane connectivity requirements.
• Power Supply — Core voltage supply range of 910 mV–970 mV to match system power design constraints.
• Package & Mounting — 784‑ball FCBGA (29 mm × 29 mm) surface‑mount package for compact board integration.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
• Regulatory Compliance — RoHS compliant for use in lead‑free assemblies.

Typical Applications

• High‑density signal processing — Use the large logic and embedded RAM to implement multi‑channel DSP pipelines and buffering.
• Networking and protocol processing — 400 I/O and substantial logic resources support packet handling, protocol engines, and interface bridging.
• Embedded system controllers — Industrial control and automation designs benefit from the device’s logic capacity and wide operating temperature range.

Unique Advantages

• High logic density: 128,000 logic elements deliver the capacity needed for complex, multi‑function FPGA designs.
• Generous on‑chip memory: Approximately 9.7 Mbits of embedded RAM reduces dependence on external memory for many buffering and state‑storage needs.
• Extensive external interfacing: 400 I/O pins allow flexible connectivity to a wide range of peripherals and external devices.
• Industrial readiness: −40 °C to 100 °C operating range and industrial grade designation support deployment in harsh environments.
• Compact FCBGA package: 784‑ball (29×29 mm) surface‑mount footprint enables high‑density PCB layouts.
• RoHS compliant: Facilitates use in modern, lead‑free manufacturing processes.

Why Choose XC6VLX130T-L1FFG784I?

The XC6VLX130T-L1FFG784I positions itself as a high‑capacity, industrial‑grade FPGA option for designs that require a combination of large programmable logic resources, substantial on‑chip memory, and numerous I/O. Its core voltage range and FCBGA surface‑mount package support integration into compact, power‑constrained systems.

This device is well suited to engineers developing complex embedded, networking, or signal‑processing systems that demand scalable logic capacity, significant embedded RAM, and reliable operation across industrial temperature ranges.

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