XC6VLX130T-L1FFG484C

IC FPGA 240 I/O 484FBGA
Part Description

Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 240 9732096 128000 484-BBGA

Quantity 446 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O240Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs10000Number of Logic Elements/Cells128000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits9732096

Overview of XC6VLX130T-L1FFG484C – Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 240 9732096 128000 484-BBGA

The XC6VLX130T-L1FFG484C is a Virtex®-6 LXT field programmable gate array (FPGA) manufactured by AMD. It provides a high-capacity programmable fabric implemented in a 484-ball BGA package with surface-mount mounting.

Key on-chip resources include 128,000 logic elements, approximately 9.73 Mbits of embedded memory, and 240 user I/Os. The device operates from a supply voltage range of 870 mV to 930 mV and is specified for commercial-grade operation from 0 °C to 85 °C. The part is RoHS compliant.

Key Features

  • Core and Logic  128,000 logic elements providing substantial programmable logic capacity for complex designs. The device includes approximately 10,000 CLBs (configurable logic blocks).
  • Embedded Memory  Approximately 9.73 Mbits of on-chip RAM to support large buffering, lookup tables, and state storage without external memory.
  • I/O Resources  240 user I/Os to support multiple interfaces and parallel connectivity options in a single device.
  • Package and Mounting  484-ball BGA package (Supplier device package: 484-FBGA, 23×23) with surface-mount assembly for compact board-level integration.
  • Power  Defined core supply range from 870 mV to 930 mV to match system power rails and design constraints.
  • Operating Conditions  Commercial grade device specified for operation from 0 °C to 85 °C.
  • Compliance  RoHS compliant to support regulatory and manufacturing requirements.

Unique Advantages

  • High logic capacity: 128,000 logic elements enable implementation of large, partitioned designs within a single FPGA package.
  • Significant embedded memory: Approximately 9.73 Mbits of on-chip RAM reduces dependence on external memory for buffering and data storage.
  • Extensive I/O count: 240 I/Os provide flexibility for multiple parallel interfaces, expansion headers, and mixed-signal front-ends.
  • Compact BGA footprint: 484-ball FBGA (23×23) packaging allows high-density board-level integration while keeping board area minimized.
  • Commercial-grade operating range: Specified 0 °C to 85 °C operation suits a wide range of commercial and industrial-adjacent applications.
  • Regulatory readiness: RoHS compliance supports green manufacturing and supply-chain requirements.

Why Choose XC6VLX130T-L1FFG484C?

The XC6VLX130T-L1FFG484C positions itself as a high-capacity Virtex®-6 LXT FPGA from AMD that balances large programmable logic resources, substantial embedded memory, and a high I/O count in a compact 484-ball BGA package. Its defined supply range and commercial operating specification make it suitable for designs that require dense logic integration and significant on-chip memory without expanding board-level complexity.

Choose this device for designs that demand scalability of logic and memory resources within a single FPGA, while retaining RoHS compliance and a compact surface-mount package for efficient PCB integration.

Request a quote or submit an inquiry for XC6VLX130T-L1FFG484C to obtain pricing and availability information.

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