XC6VLX130T-L1FFG1156C

The XC6VLX130T-L1FFG1156C is a Virtex®-6 LXT field programmable gate array (FPGA) IC designed for applications that require high logic density and substantial on-chip memory. It combines a large number of logic elements with extensive embedded RAM and a high I/O count in a compact 1156-FCBGA package.

Targeted at commercial-grade systems, this device provides designers with a configurable hardware platform that supports complex digital designs within a 0 °C to 85 °C operating range and a supply voltage range of 870 mV to 930 mV.

Key Features

• Logic Capacity  Provides 128000 logic elements and 10000 CLBs to support complex, high-density digital designs.
• Embedded Memory  Includes approximately 9.73 Mbits of on-chip RAM for buffering, lookup tables, and intermediate data storage.
• I/O Resources  Offers 600 I/O pins to support wide external connectivity and parallel interfaces.
• Power  Operates within a supply voltage range of 870 mV to 930 mV to match system power requirements.
• Package & Mounting  Supplied in a 1156-FCBGA (35×35) 1156-BBGA surface-mount package for high-density PCB integration.
• Operating Range & Grade  Commercial-grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance  RoHS compliant for restricted-substance requirements.

Typical Applications

• High-density digital systems  Used where large logic resources (128000 logic elements) are required to implement complex custom logic and control functions.
• Signal processing and buffering  Applicable to designs that need substantial on-chip memory—approximately 9.73 Mbits—for data buffering and intermediate storage.
• Connectivity and interface aggregation  Suitable for systems requiring a high number of I/O lines (600) to manage multiple parallel or serial interfaces.
• Prototyping and platform development  Provides a commercially graded FPGA platform for validating and iterating digital designs within standard temperature and power envelopes.

Unique Advantages

• High logic density: 128000 logic elements enable implementation of large-scale, complex logic functions without external glue logic.
• Significant on-chip memory: Approximately 9.73 Mbits of embedded RAM reduces reliance on external memory and improves data throughput for internal processing.
• Extensive I/O: 600 I/O pins provide flexibility for connecting multiple peripherals, sensors, or high-bandwidth interfaces.
• Compact FCBGA packaging: 1156-FCBGA (35×35) package balances high pin count with a small PCB footprint for space-constrained designs.
• Commercial-grade operating range: Rated 0 °C to 85 °C to match typical commercial applications and system environments.
• Regulatory readiness: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XC6VLX130T-L1FFG1156C?

The XC6VLX130T-L1FFG1156C from AMD combines substantial logic capacity, large embedded RAM, and a high I/O count in a compact FCBGA package, making it well suited for commercial systems that demand dense programmable logic and on-chip memory. Its defined supply voltage range and commercial operating temperature make it a pragmatic choice for mainstream embedded, communications, and digital signal processing designs.

This FPGA is appropriate for designers and teams seeking a scalable, high-capacity programmable fabric that integrates many system functions on-chip, helping reduce board-level complexity and component count while supporting iterative hardware development.

Request a quote or submit an inquiry today to evaluate the XC6VLX130T-L1FFG1156C for your next design project.