XC6VLX130T-3FFG1156C

The XC6VLX130T-3FFG1156C is a Virtex®-6 LXT FPGA IC from AMD offering 128,000 logic elements, approximately 9.73 Mbits of embedded RAM and 600 I/O pins in a 1156-ball FCBGA package. It is supplied in a surface-mount 1156-FCBGA (35×35) package and is rated for commercial temperature operation (0 °C to 85 °C).

With a core voltage range of 0.95 V to 1.05 V and RoHS compliance, this device targets commercial applications that require high logic density, significant on-chip memory, and a large I/O count for system-level integration and programmable logic implementation.

Key Features

• Core Logic — 128,000 logic elements provide substantial programmable logic capacity for complex digital designs.
• Embedded Memory — Approximately 9.73 Mbits of on-chip RAM to support buffering, fast data paths, and local storage.
• I/O Capacity — 600 I/O pins to support wide parallel interfaces and diverse external connectivity requirements.
• Package & Mounting — 1156-FCBGA (35×35) package in a surface-mount form factor for compact system integration.
• Power — Core supply voltage range of 0.95 V to 1.05 V to match targeted power delivery designs.
• Operating Range & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant for environmental and regulatory conformity.

Typical Applications

• Commercial Embedded Systems — Implement complex control, signal processing or protocol bridging where high logic density and on-chip memory accelerate development.
• High I/O Interface Design — Support for wide parallel buses and multiple peripherals using the device’s 600 I/O pins.
• System Prototyping and Integration — Compact 1156-FCBGA package and surface-mount mounting make the device suitable for prototype and production boards in commercial products.

Unique Advantages

• High Logic Density: 128,000 logic elements enable consolidation of complex functions into a single FPGA, reducing external component count.
• Substantial On-Chip Memory: Approximately 9.73 Mbits of embedded RAM supports local data buffering and low-latency processing.
• Large I/O Count: 600 I/Os allow flexible interfacing to multiple subsystems without extensive external multiplexing.
• Compact, Surface-Mount Package: 1156-FCBGA (35×35) supports space-constrained board layouts while maintaining robust connectivity.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for use in standard commercial environments and applications.
• RoHS Compliant: Environmentally compliant manufacturing and supply chain compatibility.

Why Choose XC6VLX130T-3FFG1156C?

The XC6VLX130T-3FFG1156C positions itself as a high-density, commercially rated FPGA for designs that require a large number of logic elements, significant embedded RAM, and extensive I/O. Its 1156-FCBGA surface-mount package and defined core voltage range support streamlined board-level integration and power planning.

This device is well suited for engineering teams and procurement looking for a robust Virtex®-6 LXT FPGA option for commercial system designs where on-chip memory, I/O capacity, and programmable logic density are key design drivers.

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