XC6VLX130T-2FFG484C

The XC6VLX130T-2FFG484C is a Virtex®-6 LXT field-programmable gate array from AMD. It provides a high-density reprogrammable logic resource with 128,000 logic elements and approximately 9.73 Mbits of embedded memory.

Key device characteristics include 240 general-purpose I/O, a 484-ball FBGA package (23×23), commercial operating range (0 °C to 85 °C), surface-mount mounting, RoHS compliance, and a core voltage supply range of 0.95 V to 1.05 V.

Key Features

• Logic Capacity  128,000 logic elements to support large, complex FPGA designs and high integration of custom logic.
• Embedded Memory  Approximately 9.73 Mbits of on-chip RAM for buffering, packet processing, or state storage within user logic.
• I/O Resources  240 I/O pins to enable broad connectivity options to external peripherals and subsystems.
• Package and Mounting  484-ball BBGA / 484-FBGA (23×23) package in a surface-mount form factor for compact PCB integration.
• Power  Core supply operating between 0.95 V and 1.05 V to match system power rails and design requirements.
• Operating Conditions  Commercial-grade device rated for 0 °C to 85 °C operation and compliant with RoHS environmental requirements.

Typical Applications

• Logic-intensive design implementations  Devices that require substantial programmable logic and on-chip memory for custom processing pipelines.
• High-density I/O interfacing  Systems needing dozens to hundreds of general-purpose I/O signals for peripheral and subsystem connectivity.
• Compact board-level integration  Applications where a surface-mount 484-ball FBGA package fits constrained PCB layouts while delivering significant logic resources.

Unique Advantages

• High logic integration: 128,000 logic elements reduce the need for multiple discrete devices and simplify complex logic consolidation.
• Substantial on-chip memory: Approximately 9.73 Mbits of embedded RAM supports buffering and local storage without external memory.
• Flexible I/O count: 240 I/O pins provide versatile connectivity for a wide range of external interfaces.
• Surface-mount BBGA package: 484-ball FBGA (23×23) format enables dense PCB placement and soldered board-level reliability.
• Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Why Choose XC6VLX130T-2FFG484C?

The XC6VLX130T-2FFG484C offers a balanced combination of large programmable logic capacity, embedded memory, and broad I/O in a compact surface-mount FBGA package. Its commercial-grade qualification and RoHS compliance make it suitable for mainstream electronic products that require substantial on-chip resources.

This device is well suited to designers and teams planning high-density, board-level FPGA implementations that prioritize integration of logic, memory, and I/O while maintaining standard commercial operating conditions and supply requirements.

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