XC6VLX130T-2FFG784C

The XC6VLX130T-2FFG784C is a Virtex®-6 LXT Field Programmable Gate Array from AMD, supplied in a 784-ball FCBGA package. It targets commercial electronic designs that require a large number of logic elements, significant on-chip memory, and extensive I/O connectivity.

With 128,000 logic elements, approximately 9.73 Mbits of embedded memory, and 400 I/O pins, this device is well suited to dense logic implementation, memory-rich processing blocks, and high-pin-count interface designs while operating within standard commercial temperature and voltage ranges.

Key Features

• Core Logic  128,000 logic elements for complex, high-density logic implementation.
• Embedded Memory  Approximately 9.73 Mbits of on-chip RAM to support local buffering, lookup tables, and block memory functions.
• I/O Capacity  400 I/O pins to accommodate multiple parallel interfaces, external memory connections, and mixed-signal front-ends.
• Package & Mounting  Supplied in a 784-ball BBGA/FCBGA package (supplier device package: 784-FCBGA, 29×29) optimized for surface-mount assembly.
• Power  Core voltage supply range of 950 mV to 1.05 V for compatibility with low-voltage power rails.
• Temperature & Grade  Commercial grade operation from 0 °C to 85 °C for standard commercial electronics deployments.
• Environmental Compliance  RoHS compliant for regulatory alignment with lead-free assembly requirements.

Typical Applications

• High-density logic processing  Implement large custom logic functions and complex state machines using the device’s 128,000 logic elements.
• Memory-intensive modules  Use the approximately 9.73 Mbits of embedded RAM for buffering, packet processing, or LUT-based algorithms.
• Multi-interface systems  Leverage 400 I/O pins for interfacing to sensors, peripherals, external memory, and high-pin-count connectors.

Unique Advantages

• Highly integrated logic and memory: Combines a large logic fabric with substantial on-chip RAM to reduce external memory requirements and simplify board-level design.
• Extensive I/O availability: 400 I/Os enable flexible partitioning of interfaces and support for multiple parallel connections without extensive multiplexing.
• Compact surface-mount packaging: 784-FCBGA (29×29) package provides a high-density footprint suitable for space-constrained PCBs while maintaining thermal and electrical performance.
• Low-voltage core compatibility: Operates from 950 mV to 1.05 V, aligning with modern low-voltage power domains.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to meet the needs of mainstream commercial electronic products.
• Regulatory alignment: RoHS compliance supports lead-free manufacturing flows.

Why Choose XC6VLX130T-2FFG784C?

The XC6VLX130T-2FFG784C positions itself as a high-density, memory-capable FPGA for commercial applications that require significant logic resources and broad I/O connectivity. Its combination of 128,000 logic elements, approximately 9.73 Mbits of embedded memory, and 400 I/Os offers designers the integration needed to consolidate functions and reduce board-level complexity.

Manufactured by AMD and provided in a 784-FCBGA surface-mount package, this device is suited to engineers developing scalable, memory-rich systems within standard commercial temperature and voltage envelopes. The XC6VLX130T-2FFG784C supports longer-term design stability through its established vendor lineage and compliance with RoHS requirements.

Request a quote or submit an inquiry to get pricing, availability, and additional ordering information for the XC6VLX130T-2FFG784C.