XC6VLX130T-2FFG784I

The XC6VLX130T-2FFG784I is a Virtex®-6 LXT field programmable gate array (FPGA) offered in a 784-ball FCBGA package. It delivers a high logic capacity and substantial embedded RAM, combined with a 400-pin I/O count and industrial-grade operating range.

This device is suited for designs that require large on-chip logic and memory resources while operating at a core supply between 0.95 V and 1.05 V and temperatures from −40 °C to 100 °C.

Key Features

• Logic Capacity — 128,000 logic elements and 10,000 configurable logic blocks provide substantial programmable fabric for complex digital functions.
• Embedded Memory — Approximately 9.73 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without external memory.
• I/O Resources — 400 user I/O pins to accommodate multiple interfaces, parallel buses, and high-pin-count connectivity requirements.
• Power — Core supply voltage range of 0.95 V to 1.05 V for integration with precision power-rail designs.
• Package & Mounting — 784-FCBGA (29 × 29 mm) package; surface-mount mounting for compact PCB integration.
• Operating Range — Industrial-grade temperature specification from −40 °C to 100 °C for reliable operation in demanding environments.
• Compliance — RoHS compliant to meet common environmental and manufacturing requirements.

Unique Advantages

• High on-chip programmability: 128,000 logic elements enable integration of complex, custom digital functions within a single FPGA, reducing the need for external ASICs or multiple devices.
• Significant embedded RAM: Approximately 9.73 Mbits of internal RAM supports data buffering and memory-intensive logic without relying on external memory components.
• Large I/O count: 400 I/O pins simplify routing of multiple interfaces and peripherals, helping to reduce board-level interconnect complexity.
• Industrial temperature range: Specified operation from −40 °C to 100 °C provides suitability for systems exposed to wide temperature swings.
• Compact FCBGA package: The 784-ball FCBGA (29 × 29 mm) package supports high-density PCB layouts while maintaining a large device footprint for I/O and power delivery.
• RoHS compliant: Meets environmental standards for materials used in manufacturing and assembly.

Why Choose XC6VLX130T-2FFG784I?

The XC6VLX130T-2FFG784I positions itself where high logic density, significant embedded memory, and extensive I/O are required in an industrial-temperature FPGA. Its core voltage window and FCBGA packaging allow integration into designs that demand controlled power delivery and compact, high-density board layouts.

This device is a practical choice for development teams and procurement groups seeking a programmable platform that combines large on-chip resources with industrial operating range and RoHS compliance, offering a scalable foundation for complex digital systems.

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