XC6VLX195T-3FFG1156C

IC FPGA 600 I/O 1156FCBGA
Part Description

Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 600 12681216 199680 1156-BBGA, FCBGA

Quantity 542 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1156-FCBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1156-BBGA, FCBGANumber of I/O600Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs15600Number of Logic Elements/Cells199680
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12681216

Overview of XC6VLX195T-3FFG1156C – Virtex®-6 LXT Field Programmable Gate Array (FPGA), 1156-FCBGA (35×35)

The XC6VLX195T-3FFG1156C is a Virtex®-6 LXT Field Programmable Gate Array (FPGA) from AMD offered in a 1156-ball FCBGA surface-mount package. It delivers a large logic fabric and on-chip memory along with extensive I/O capability for complex digital designs.

With 199,680 logic elements, approximately 12.68 Mbits of embedded memory, and 600 I/O, this commercial-grade FPGA is suited to applications that require high integration in a compact 35×35 mm package while operating within a 0.95–1.05 V core supply range and a 0 °C to 85 °C commercial temperature window.

Key Features

  • Core Logic  199,680 logic elements provide a large programmable fabric for implementing complex custom logic and high-density designs.
  • Embedded Memory  Approximately 12.68 Mbits of on-chip RAM to support data buffering, state storage, and memory-hungry logic functions.
  • I/O Capacity  600 I/O pins to accommodate wide parallel interfaces, multi-channel connectivity, and dense board-level integration.
  • Package & Mounting  1156-ball FCBGA (35×35 mm) surface-mount package for compact system integration and high pin-count routing.
  • Power  Core supply range of 0.95 V to 1.05 V to match platform power design constraints.
  • Operating Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Regulatory  RoHS compliant for adherence to common material and environmental requirements.

Typical Applications

  • High-density custom logic implementations  Leverage 199,680 logic elements for tailored datapath and control logic in complex digital systems.
  • Memory-focused designs  Use approximately 12.68 Mbits of embedded RAM for buffering, packet processing, and temporary storage.
  • I/O-rich system interfaces  600 I/O pins support wide parallel buses, multiple interfaces, and dense connectivity requirements.
  • Compact board-level integration  The 1156-FCBGA (35×35) package enables high pin count in a compact footprint for space-constrained platforms.

Unique Advantages

  • High logic capacity: 199,680 logic elements enable substantial on-chip programmable resources for complex designs.
  • Significant embedded memory: Approximately 12.68 Mbits of RAM reduces dependence on external memory for many applications.
  • Extensive I/O: 600 I/O pins simplify integration with multiple peripherals and high-bandwidth interfaces.
  • Compact, high-pin-count package: 1156-FCBGA (35×35) balances pin density with a board-friendly surface-mount form factor.
  • Controlled core voltage: 0.95–1.05 V supply range supports consistent power planning for the FPGA core.
  • RoHS compliant: Meets common environmental-material requirements for commercial electronics.

Why Choose XC6VLX195T-3FFG1156C?

The XC6VLX195T-3FFG1156C positions itself as a high-capacity Virtex®-6 LXT FPGA option for designers who need a large programmable fabric, meaningful on-chip memory, and abundant I/O in a single surface-mount FCBGA package. Its specifications support integration into commercial-temperature electronic systems where board space and pin count are key considerations.

This part is suited to teams building complex digital logic, memory-intensive functions, or I/O-heavy interfaces that require a compact package and clearly defined power and thermal operating ranges.

Request a quote or submit an inquiry to receive pricing and availability for the XC6VLX195T-3FFG1156C and to discuss how it fits your next design.

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