XC6VLX195T-3FFG1156C
| Part Description |
Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 600 12681216 199680 1156-BBGA, FCBGA |
|---|---|
| Quantity | 542 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1156-FCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA, FCBGA | Number of I/O | 600 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 15600 | Number of Logic Elements/Cells | 199680 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12681216 |
Overview of XC6VLX195T-3FFG1156C – Virtex®-6 LXT Field Programmable Gate Array (FPGA), 1156-FCBGA (35×35)
The XC6VLX195T-3FFG1156C is a Virtex®-6 LXT Field Programmable Gate Array (FPGA) from AMD offered in a 1156-ball FCBGA surface-mount package. It delivers a large logic fabric and on-chip memory along with extensive I/O capability for complex digital designs.
With 199,680 logic elements, approximately 12.68 Mbits of embedded memory, and 600 I/O, this commercial-grade FPGA is suited to applications that require high integration in a compact 35×35 mm package while operating within a 0.95–1.05 V core supply range and a 0 °C to 85 °C commercial temperature window.
Key Features
- Core Logic 199,680 logic elements provide a large programmable fabric for implementing complex custom logic and high-density designs.
- Embedded Memory Approximately 12.68 Mbits of on-chip RAM to support data buffering, state storage, and memory-hungry logic functions.
- I/O Capacity 600 I/O pins to accommodate wide parallel interfaces, multi-channel connectivity, and dense board-level integration.
- Package & Mounting 1156-ball FCBGA (35×35 mm) surface-mount package for compact system integration and high pin-count routing.
- Power Core supply range of 0.95 V to 1.05 V to match platform power design constraints.
- Operating Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Regulatory RoHS compliant for adherence to common material and environmental requirements.
Typical Applications
- High-density custom logic implementations Leverage 199,680 logic elements for tailored datapath and control logic in complex digital systems.
- Memory-focused designs Use approximately 12.68 Mbits of embedded RAM for buffering, packet processing, and temporary storage.
- I/O-rich system interfaces 600 I/O pins support wide parallel buses, multiple interfaces, and dense connectivity requirements.
- Compact board-level integration The 1156-FCBGA (35×35) package enables high pin count in a compact footprint for space-constrained platforms.
Unique Advantages
- High logic capacity: 199,680 logic elements enable substantial on-chip programmable resources for complex designs.
- Significant embedded memory: Approximately 12.68 Mbits of RAM reduces dependence on external memory for many applications.
- Extensive I/O: 600 I/O pins simplify integration with multiple peripherals and high-bandwidth interfaces.
- Compact, high-pin-count package: 1156-FCBGA (35×35) balances pin density with a board-friendly surface-mount form factor.
- Controlled core voltage: 0.95–1.05 V supply range supports consistent power planning for the FPGA core.
- RoHS compliant: Meets common environmental-material requirements for commercial electronics.
Why Choose XC6VLX195T-3FFG1156C?
The XC6VLX195T-3FFG1156C positions itself as a high-capacity Virtex®-6 LXT FPGA option for designers who need a large programmable fabric, meaningful on-chip memory, and abundant I/O in a single surface-mount FCBGA package. Its specifications support integration into commercial-temperature electronic systems where board space and pin count are key considerations.
This part is suited to teams building complex digital logic, memory-intensive functions, or I/O-heavy interfaces that require a compact package and clearly defined power and thermal operating ranges.
Request a quote or submit an inquiry to receive pricing and availability for the XC6VLX195T-3FFG1156C and to discuss how it fits your next design.

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