XC6VLX195T-L1FFG1156C

IC FPGA 600 I/O 1156FCBGA
Part Description

Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 600 12681216 199680 1156-BBGA, FCBGA

Quantity 542 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1156-FCBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1156-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs15600Number of Logic Elements/Cells199680
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12681216

Overview of XC6VLX195T-L1FFG1156C – Virtex®-6 LXT FPGA, 1156-FCBGA (35×35)

The XC6VLX195T-L1FFG1156C is a Virtex®-6 LXT field programmable gate array (FPGA) IC from AMD supplied in a 1156-BBGA FCBGA package. It delivers a high logic capacity and on-chip memory in a surface-mount FPGA optimized for commercial-grade applications.

Key device attributes include 199,680 logic elements, approximately 12.68 Mbits of embedded memory, 600 I/O pins, a core voltage supply range of 870 mV to 930 mV, and an operating temperature range of 0 °C to 85 °C.

Key Features

  • Logic Capacity 199,680 logic elements to support complex digital designs and high levels of logic integration.
  • Embedded Memory Approximately 12.68 Mbits of on-chip RAM available for buffering, packet storage, and intermediate data processing.
  • I/O Density 600 I/O pins to enable broad connectivity and interface options for multi-channel designs.
  • Power Supply Core voltage supply range of 870 mV to 930 mV for defined power budgeting and regulator selection.
  • Package and Mounting 1156-FCBGA package (supplier device package: 1156-FCBGA (35×35)), surface-mount mounting type for board-level assembly.
  • Operating Temperature and Grade Commercial-grade device rated for operation from 0 °C to 85 °C.
  • Regulatory Compliance RoHS compliant.

Unique Advantages

  • High integration density: 199,680 logic elements and substantial embedded RAM reduce the need for external logic and memory components.
  • Extensive I/O support: 600 I/Os provide flexibility for multi-protocol interfaces and parallel/peripheral connectivity.
  • Compact FCBGA package: 1156-FCBGA (35×35) surface-mount packaging simplifies PCB routing while supporting high pin counts.
  • Defined power envelope: Narrow core voltage range (870 mV–930 mV) enables predictable power-supply design and thermal planning.
  • Commercial temperature rating: Specified 0 °C to 85 °C operating range for mainstream commercial applications.
  • RoHS compliant: Meets environmental-restricted materials requirements for regulated markets.

Why Choose XC6VLX195T-L1FFG1156C?

The XC6VLX195T-L1FFG1156C positions itself as a high-capacity Virtex®-6 LXT FPGA option for commercial designs that require large logic resources, substantial on-chip memory, and significant I/O availability in a single surface-mount package. Its clear power-supply requirements and commercial temperature rating make it suitable for mainstream embedded and digital processing projects where verified specification adherence is important.

Choose this part when your design demands a combination of high logic density, embedded memory, and broad I/O count while maintaining RoHS compliance and a compact FCBGA form factor. The device is well suited to teams focused on scalable, high-integration FPGA-based solutions backed by AMD’s Virtex®-6 lineage.

Request a quote or submit an inquiry to receive pricing and availability for the XC6VLX195T-L1FFG1156C.

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