XC6VLX195T-L1FFG1156C
| Part Description |
Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 600 12681216 199680 1156-BBGA, FCBGA |
|---|---|
| Quantity | 542 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1156-FCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 15600 | Number of Logic Elements/Cells | 199680 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12681216 |
Overview of XC6VLX195T-L1FFG1156C – Virtex®-6 LXT FPGA, 1156-FCBGA (35×35)
The XC6VLX195T-L1FFG1156C is a Virtex®-6 LXT field programmable gate array (FPGA) IC from AMD supplied in a 1156-BBGA FCBGA package. It delivers a high logic capacity and on-chip memory in a surface-mount FPGA optimized for commercial-grade applications.
Key device attributes include 199,680 logic elements, approximately 12.68 Mbits of embedded memory, 600 I/O pins, a core voltage supply range of 870 mV to 930 mV, and an operating temperature range of 0 °C to 85 °C.
Key Features
- Logic Capacity 199,680 logic elements to support complex digital designs and high levels of logic integration.
- Embedded Memory Approximately 12.68 Mbits of on-chip RAM available for buffering, packet storage, and intermediate data processing.
- I/O Density 600 I/O pins to enable broad connectivity and interface options for multi-channel designs.
- Power Supply Core voltage supply range of 870 mV to 930 mV for defined power budgeting and regulator selection.
- Package and Mounting 1156-FCBGA package (supplier device package: 1156-FCBGA (35×35)), surface-mount mounting type for board-level assembly.
- Operating Temperature and Grade Commercial-grade device rated for operation from 0 °C to 85 °C.
- Regulatory Compliance RoHS compliant.
Unique Advantages
- High integration density: 199,680 logic elements and substantial embedded RAM reduce the need for external logic and memory components.
- Extensive I/O support: 600 I/Os provide flexibility for multi-protocol interfaces and parallel/peripheral connectivity.
- Compact FCBGA package: 1156-FCBGA (35×35) surface-mount packaging simplifies PCB routing while supporting high pin counts.
- Defined power envelope: Narrow core voltage range (870 mV–930 mV) enables predictable power-supply design and thermal planning.
- Commercial temperature rating: Specified 0 °C to 85 °C operating range for mainstream commercial applications.
- RoHS compliant: Meets environmental-restricted materials requirements for regulated markets.
Why Choose XC6VLX195T-L1FFG1156C?
The XC6VLX195T-L1FFG1156C positions itself as a high-capacity Virtex®-6 LXT FPGA option for commercial designs that require large logic resources, substantial on-chip memory, and significant I/O availability in a single surface-mount package. Its clear power-supply requirements and commercial temperature rating make it suitable for mainstream embedded and digital processing projects where verified specification adherence is important.
Choose this part when your design demands a combination of high logic density, embedded memory, and broad I/O count while maintaining RoHS compliance and a compact FCBGA form factor. The device is well suited to teams focused on scalable, high-integration FPGA-based solutions backed by AMD’s Virtex®-6 lineage.
Request a quote or submit an inquiry to receive pricing and availability for the XC6VLX195T-L1FFG1156C.

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