XC6VLX240T-1FF1156I

The XC6VLX240T-1FF1156I is a Virtex®-6 LXT field programmable gate array (FPGA) manufactured by AMD, supplied in a 1156-FCBGA package. This industrial-grade device combines a large pool of programmable logic, substantial on-chip RAM, and a high I/O count for systems that require significant integration and configurability.

With a wide operating temperature range and a low-voltage core supply, the device is sized for designs that need high logic density, extensive embedded memory, and flexible I/O connectivity while meeting industrial environmental requirements.

Key Features

• Logic Capacity — 241,152 logic elements and 18,840 configurable logic blocks (CLBs) to implement complex, high-density digital designs.
• Embedded Memory — Approximately 15.33 Mbits of on-chip RAM for buffering, state storage, and temporary data processing.
• I/O Density — 600 user I/O pins to support extensive external interfaces and parallel connectivity requirements.
• Package and Mounting — 1156-BBGA / 1156-FCBGA (35x35) package in a surface-mount form factor for compact board-level integration.
• Power — Core voltage supply range from 0.95 V to 1.05 V to match low-voltage system rails.
• Temperature and Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance — RoHS compliant for adherence to common environmental standards.

Typical Applications

• Industrial Control Systems — Used where industrial temperature tolerance, significant logic resources, and many I/O are required for control, monitoring, and automation tasks.
• Custom Hardware Acceleration — Suitable for designs that need large programmable logic and embedded RAM to implement application-specific accelerators and processing pipelines.
• I/O-Intensive Systems — Appropriate for systems aggregating many external signals or sensors that require a high count of user I/Os.

Unique Advantages

• High Logic Integration: 241,152 logic elements enable consolidation of complex functions onto a single device, reducing system-level component count.
• Substantial On-Chip Memory: Approximately 15.33 Mbits of embedded RAM supports large buffers and local data storage for streamlined data handling.
• Large I/O Capacity: 600 I/O pins provide the flexibility to connect numerous peripherals, sensors, or parallel interfaces without external multiplexing.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compact, Surface-Mount Package: 1156-FCBGA package offers a high-density footprint for space-constrained board designs.
• RoHS Compliant: Aligns with environmental and manufacturing requirements for reduced hazardous substances.

Why Choose XC6VLX240T-1FF1156I?

The XC6VLX240T-1FF1156I positions itself as a high-density, industrial-grade FPGA option from AMD, combining extensive logic resources, significant embedded memory, and a large I/O complement in a compact FCBGA package. Its voltage and temperature specifications make it suitable for designs that require reliable operation across a wide range of conditions.

This device is ideal for engineering teams developing complex, I/O-rich systems that benefit from on-chip integration to reduce BOM complexity while retaining the configurability of an FPGA. Its feature set supports scalable, robust designs where logic capacity, memory, and I/O count drive system capabilities.

Request a quote or submit a sales inquiry to evaluate XC6VLX240T-1FF1156I availability and pricing for your next design project.