XC6VLX240T-1FF784C
| Part Description |
Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 400 15335424 241152 784-BBGA, FCBGA |
|---|---|
| Quantity | 191 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 784-FCBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 784-BBGA, FCBGA | Number of I/O | 400 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 18840 | Number of Logic Elements/Cells | 241152 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 15335424 |
Overview of XC6VLX240T-1FF784C – Virtex®-6 LXT FPGA, 784‑BBGA FCBGA, 400 I/O
The XC6VLX240T-1FF784C is a Virtex®-6 LXT field programmable gate array (FPGA) from AMD. It delivers a high logic capacity device with on-chip embedded memory and a large I/O count suitable for complex digital designs.
Key device attributes include 241,152 logic elements, approximately 15.3 Mbits of embedded memory, 400 user I/Os, a 784‑FCBGA (29×29) package in a surface-mount format, and an operating voltage range of 0.95 V to 1.05 V. The device is RoHS compliant and specified for commercial temperature operation (0 °C to 85 °C).
Key Features
- Core Architecture Virtex®-6 LXT field programmable gate array architecture as identified by the product name.
- Logic Capacity 241,152 logic elements to support large-scale logic integration and complex implementations.
- Embedded Memory Approximately 15.3 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic.
- High I/O Count 400 user I/Os to support multiple interfaces and parallel connectivity requirements.
- Power Core supply range specified at 0.95 V to 1.05 V for defined operating conditions.
- Package & Mounting 784‑BBGA / 784‑FCBGA (29×29) package supplied in a surface-mount form factor for board-level integration.
- Grade & Temperature Commercial-grade device specified for operation from 0 °C to 85 °C.
- Environmental Compliance RoHS compliant.
Unique Advantages
- High logic density: 241,152 logic elements enable consolidation of large designs into a single FPGA device, reducing board-level complexity.
- Substantial on-chip memory: Approximately 15.3 Mbits of embedded RAM supports data buffering and memory-intensive functions without external memory.
- Extensive I/O resources: 400 user I/Os allow flexible interfacing to peripherals, high-speed links, and parallel buses.
- Compact, standard package: 784‑FCBGA (29×29) surface-mount package offers a dense, industry-standard footprint for system integration.
- Defined operating envelope: Commercial temperature range and a specified core voltage window support predictable deployment in commercial applications.
- Regulatory conformity: RoHS compliance supports environmental and manufacturing requirements.
Why Choose XC6VLX240T-1FF784C?
The XC6VLX240T-1FF784C positions itself as a high-capacity Virtex®-6 LXT FPGA option for designs that require sizable logic resources, significant on-chip memory, and abundant I/O. Its defined power and temperature specifications, compact 784‑FCBGA package, and RoHS compliance make it suitable for commercial-grade systems where integration density and predictable specification are important.
As an AMD device, it provides a clearly specified hardware building block for engineers developing complex digital systems that benefit from high logic density and embedded memory capacity.
Request a quote for XC6VLX240T-1FF784C to check availability and pricing for your next design.

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Certifications and Memberships: ISO9001:2015, RoHS, REACH








