XC6VLX240T-1FF784C

IC FPGA 400 I/O 784FCBGA
Part Description

Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 400 15335424 241152 784-BBGA, FCBGA

Quantity 191 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package784-FCBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case784-BBGA, FCBGANumber of I/O400Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs18840Number of Logic Elements/Cells241152
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits15335424

Overview of XC6VLX240T-1FF784C – Virtex®-6 LXT FPGA, 784‑BBGA FCBGA, 400 I/O

The XC6VLX240T-1FF784C is a Virtex®-6 LXT field programmable gate array (FPGA) from AMD. It delivers a high logic capacity device with on-chip embedded memory and a large I/O count suitable for complex digital designs.

Key device attributes include 241,152 logic elements, approximately 15.3 Mbits of embedded memory, 400 user I/Os, a 784‑FCBGA (29×29) package in a surface-mount format, and an operating voltage range of 0.95 V to 1.05 V. The device is RoHS compliant and specified for commercial temperature operation (0 °C to 85 °C).

Key Features

  • Core Architecture Virtex®-6 LXT field programmable gate array architecture as identified by the product name.
  • Logic Capacity 241,152 logic elements to support large-scale logic integration and complex implementations.
  • Embedded Memory Approximately 15.3 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic.
  • High I/O Count 400 user I/Os to support multiple interfaces and parallel connectivity requirements.
  • Power Core supply range specified at 0.95 V to 1.05 V for defined operating conditions.
  • Package & Mounting 784‑BBGA / 784‑FCBGA (29×29) package supplied in a surface-mount form factor for board-level integration.
  • Grade & Temperature Commercial-grade device specified for operation from 0 °C to 85 °C.
  • Environmental Compliance RoHS compliant.

Unique Advantages

  • High logic density: 241,152 logic elements enable consolidation of large designs into a single FPGA device, reducing board-level complexity.
  • Substantial on-chip memory: Approximately 15.3 Mbits of embedded RAM supports data buffering and memory-intensive functions without external memory.
  • Extensive I/O resources: 400 user I/Os allow flexible interfacing to peripherals, high-speed links, and parallel buses.
  • Compact, standard package: 784‑FCBGA (29×29) surface-mount package offers a dense, industry-standard footprint for system integration.
  • Defined operating envelope: Commercial temperature range and a specified core voltage window support predictable deployment in commercial applications.
  • Regulatory conformity: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XC6VLX240T-1FF784C?

The XC6VLX240T-1FF784C positions itself as a high-capacity Virtex®-6 LXT FPGA option for designs that require sizable logic resources, significant on-chip memory, and abundant I/O. Its defined power and temperature specifications, compact 784‑FCBGA package, and RoHS compliance make it suitable for commercial-grade systems where integration density and predictable specification are important.

As an AMD device, it provides a clearly specified hardware building block for engineers developing complex digital systems that benefit from high logic density and embedded memory capacity.

Request a quote for XC6VLX240T-1FF784C to check availability and pricing for your next design.

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