XC6VLX195T-L1FFG784I

The XC6VLX195T-L1FFG784I is a Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC designed to deliver substantial logic and on-chip memory resources in a high-density FCBGA package. With a large logic fabric, significant embedded RAM, and a 400-pin I/O footprint, it is targeted for industrial applications and systems requiring programmable logic, wide I/O connectivity and robust operating-temperature capability.

Key Features

• Logic Capacity — 15,600 CLBs providing 199,680 logic elements to implement complex, high-density digital designs.
• Embedded Memory — Approximately 12.68 Mbits of on-chip RAM for buffering, frame storage, and intermediate data processing without immediate dependence on external memory.
• I/O Density — 400 user I/O pins to support extensive peripheral connections, bus interfaces and multi-channel I/O requirements.
• Supply Voltage — Specified operating core supply range from 910 mV to 970 mV.
• Operating Temperature Range — Industrial-rated operation from −40 °C to 100 °C for deployment in demanding environments.
• Package and Mounting — 784‑pin FCBGA package (784‑BBGA, supplier device package 784‑FCBGA, 29×29) with surface-mount design suitable for high-density PCB integration.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• Industrial Control and Automation — Use the device's industrial temperature range and large logic capacity to implement control algorithms, custom I/O handling and protocol adaptation in factory and process environments.
• Embedded Signal Processing — Leverage approximately 12.68 Mbits of on-chip RAM and extensive logic elements for buffering, preprocessing and custom signal paths in embedded systems.
• High-Density System Integration — 400 I/Os and a compact 784‑FCBGA package enable consolidation of multiple functions and interfaces onto a single programmable device for space-constrained designs.

Unique Advantages

• High Logic Density: 199,680 logic elements and 15,600 CLBs enable complex, multi-function digital implementations without immediate partitioning across devices.
• Substantial On-Chip Memory: Approximately 12.68 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage tasks.
• Extensive I/O Connectivity: 400 I/Os support broad peripheral and interface requirements, simplifying board-level signal routing and integration.
• Industrial-Grade Operation: Rated for −40 °C to 100 °C operation, suitable for industrial deployments where extended temperature tolerance is required.
• Compact, High-Density Package: 784‑FCBGA (29×29) surface-mount package supports high pin-count designs while conserving board area.
• RoHS Compliant: Meets RoHS environmental requirements for compliant manufacturing and assembly.

Why Choose XC6VLX195T-L1FFG784I?

The XC6VLX195T-L1FFG784I combines substantial logic resources, significant embedded memory and a high I/O count in a compact 784‑FCBGA package, with industrial temperature capability and RoHS compliance. This combination makes it well suited for designers building industrial systems, embedded signal-processing platforms, and high-density integration projects that require programmable, on-board logic and memory.

Backed by AMD as the manufacturer, the device offers a clear specification set for procurement and system design phases where logic capacity, I/O connectivity and industrial temperature operation are key selection criteria.

Request a quote or submit a pricing and availability inquiry to begin specifying XC6VLX195T-L1FFG784I for your project requirements.