XC6VLX195T-L1FFG784C

IC FPGA 400 I/O 784FCBGA
Part Description

Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 400 12681216 199680 784-BBGA, FCBGA

Quantity 217 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package784-FCBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case784-BBGA, FCBGANumber of I/O400Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs15600Number of Logic Elements/Cells199680
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12681216

Overview of XC6VLX195T-L1FFG784C – Virtex®-6 LXT Field Programmable Gate Array (FPGA)

The XC6VLX195T-L1FFG784C is a Virtex®-6 LXT Field Programmable Gate Array (FPGA) in a 784-FCBGA package. It provides a high logic element count and substantial embedded RAM in a surface-mount FCBGA footprint suitable for commercial-grade programmable logic designs.

Key on-chip resources include 15,600 CLBs (199,680 logic elements), approximately 12.68 Mbits of embedded memory, and 400 I/O pins, enabling dense digital integration where programmable logic, memory, and I/O capacity are required.

Key Features

  • Core Logic — 15,600 CLBs delivering 199,680 logic elements for large-scale programmable logic implementations.
  • Embedded Memory — Approximately 12.68 Mbits of on-chip RAM (12,681,216 total RAM bits) to support buffering, state storage, and on-chip data processing.
  • I/O Capacity — 400 I/O pins to support multiple interfaces and high pin-count designs.
  • Package and Mounting — 784-FCBGA (29 × 29) package case with surface-mount mounting type for compact board-level integration.
  • Power Supply — Operating supply range of 870 mV to 930 mV to define power design and sequencing requirements.
  • Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Compliance — RoHS compliant.

Unique Advantages

  • High logic capacity: 199,680 logic elements enable consolidation of complex digital functions into a single device, reducing component count.
  • Substantial on-chip memory: Approximately 12.68 Mbits of embedded RAM supports large buffers and local data storage without relying solely on external memory.
  • Extensive I/O: 400 I/O pins provide flexibility for multi-protocol interfacing and high-density connectivity on a single package.
  • Compact FCBGA package: The 784-FCBGA (29 × 29) surface-mount package helps save board area while supporting a high pin count.
  • Defined supply window: The 870–930 mV supply range gives clear parameters for power delivery and sequencing in system design.
  • Commercial and RoHS compliant: Designed for commercial applications and compliant with RoHS requirements for lead-free manufacturing processes.

Why Choose XC6VLX195T-L1FFG784C?

The XC6VLX195T-L1FFG784C positions itself as a high-density Virtex®-6 LXT FPGA option for commercial designs that require large logic capacity, significant embedded RAM, and a high number of I/O pins in a compact FCBGA package. Its combination of CLB count, logic elements, on-chip memory, and 400 I/O make it suitable for systems that consolidate multiple digital functions into a single programmable device.

Choose this device when your design priorities include integrating substantial programmable logic and on-chip memory within a defined commercial operating range and compact surface-mount package.

Request a quote or submit an inquiry to receive pricing and availability for the XC6VLX195T-L1FFG784C.

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