XC6VLX240T-1FFG1156I

The XC6VLX240T-1FFG1156I is a Virtex-6 LXT field programmable gate array (FPGA) from AMD. It provides a high density of programmable logic and on-chip memory with a broad I/O count, packaged in a 1156-ball FCBGA (35 × 35 mm) surface-mount package.

This device is designed for designs that require substantial logic resources, abundant I/O, and on-chip memory while operating across an industrial temperature range and a defined core voltage range.

Key Features

• Logic Capacity  241,152 logic elements provide large programmable logic resources for complex digital designs.
• Configurable Logic Blocks  18,840 configurable logic blocks (CLBs) enable extensive parallel processing and custom logic implementation.
• Embedded Memory  Approximately 15.3 Mbits of embedded memory supports buffering, FIFOs, and local data storage within the FPGA fabric.
• I/O Density  600 user I/Os accommodate high pin-count interfaces and multiple simultaneous high-bandwidth connections.
• Power and Voltage  Core supply range of 950 mV to 1.05 V for specified device operation.
• Package and Mounting  1156-FCBGA (35 × 35 mm) package in a surface-mount format for board-level integration in compact systems.
• Operating Range  Rated for industrial operation from −40 °C to 100 °C to support deployment in temperature-variable environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-performance signal processing  Leverage the device's large logic count and embedded memory for DSP, filtering, and custom packet processing pipelines.
• Networking and communications equipment  High I/O count and abundant logic resources enable implementation of protocol engines, switch fabrics, and line-rate interfaces.
• Embedded compute and acceleration  Use on-chip memory and programmable logic to accelerate algorithms and offload compute tasks in embedded platforms.
• Industrial control systems  Industrial temperature rating and robust I/O make the device suitable for control logic, sensor aggregation, and real-time processing in industrial environments.

Unique Advantages

• High logic density: 241,152 logic elements allow integration of complex custom logic and state machines without adding external ASICs.
• Significant embedded memory: Approximately 15.3 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage needs.
• Extensive I/O capability: 600 I/Os support multiple parallel interfaces and flexible board-level interconnects.
• Industrial temperature support: Rated from −40 °C to 100 °C for use in temperature-variable and industrial environments.
• Compact FCBGA package: 1156-ball FCBGA (35 × 35 mm) enables high-density integration on space-constrained PCBs.
• Compliance-ready: RoHS compliance supports environmentally conscious design and manufacturing requirements.

Why Choose XC6VLX240T-1FFG1156I?

The XC6VLX240T-1FFG1156I positions itself as a high-capacity, industrial-grade FPGA option for designers who need substantial programmable logic, on-chip memory, and a large I/O complement in a compact FCBGA package. Its specified operating temperature range and RoHS compliance make it suitable for demanding environments where reliability and regulatory alignment matter.

This device is a fit for development teams and engineers building complex digital systems—where integration density, configurable resources, and I/O flexibility directly impact system architecture and bill-of-materials decisions—backed by AMD as the manufacturer.

Request a quote or submit a procurement inquiry to receive pricing, availability, and lead-time information for the XC6VLX240T-1FFG1156I.