XC6VLX240T-1FFG784C

The XC6VLX240T-1FFG784C is a Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC from AMD packaged in a 784‑ball FCBGA (29×29) surface‑mount package. It delivers a high logic capacity and on‑chip memory density in a commercial‑grade device suitable for designs that require large programmable logic fabrics and substantial I/O resources.

With 241,152 logic elements, approximately 15.3 Mbits of embedded memory and 400 I/O pins, this device targets high‑density programmable applications where integration of logic, memory and I/O in a single FPGA package reduces board complexity and component count.

Key Features

• Core Logic 241,152 logic elements provide a large programmable fabric for complex digital designs and high‑level integration.
• Embedded Memory Approximately 15.3 Mbits of on‑chip RAM for data buffering, local storage and intermediate processing.
• I/O Capacity 400 user I/O pins support extensive peripheral and system connectivity without external multiplexing.
• Package 784‑BBGA (FCBGA) 29×29 surface‑mount package combines a compact footprint with high pin count for board‑level integration.
• Power Supply Core voltage range of 0.95 V to 1.05 V for the device core power domain requirements.
• Operating Range Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Regulatory RoHS compliant.

Typical Applications

• Large‑scale programmable logic systems — Designs requiring a high count of logic elements and dense on‑chip memory benefit from the device's 241,152 logic elements and approximately 15.3 Mbits of embedded RAM.
• High‑I/O interface aggregation — Systems needing many external interfaces can leverage the device's 400 I/O pins to reduce external bridging and multiplexing components.
• Compact board‑level integration — The 784‑ball FCBGA surface‑mount package enables high pin density in a compact footprint for space‑constrained designs.

Unique Advantages

• High logic density: 241,152 logic elements enable consolidation of complex digital functions into a single FPGA, simplifying system architecture.
• Substantial on‑chip memory: Approximately 15.3 Mbits of embedded RAM reduce reliance on external memory for intermediate storage and buffering.
• Wide I/O capability: 400 I/O pins provide flexible connectivity options to support multiple peripherals and interfaces directly from the FPGA.
• Compact, high‑pin package: The 784‑BBGA (29×29) FCBGA package offers high pin count in a surface‑mount form factor for dense PCB designs.
• Commercial grading: Rated for 0 °C to 85 °C operation, suitable for standard commercial applications and environments.
• RoHS compliant: Meets lead‑free and hazardous substance requirements for regulatory conformity.

Why Choose XC6VLX240T-1FFG784C?

The XC6VLX240T-1FFG784C positions itself as a high‑capacity Virtex‑6 LXT FPGA option for projects that demand a large programmable logic fabric, significant embedded memory, and a high count of user I/Os within a single compact package. Its 784‑BBGA FCBGA package and surface‑mount mounting type support dense board designs where pin count and footprint matter.

Engineers and designers seeking to consolidate multiple functions onto one FPGA while maintaining a commercial‑grade operating envelope will find this device aligned with those goals. As an AMD Virtex‑6 LXT device, it pairs high logic and memory resources with the form factor and electrical characteristics required for integrated system designs.

Request a quote or submit an inquiry to receive pricing and availability information for the XC6VLX240T-1FFG784C. Our team can provide lead‑time details and help evaluate this FPGA for your project requirements.